Tria makes technology for the world’s best products – it’s that simple.
Tria is a world leader in design and manufacturing of embedded computing. We help OEMs to embed compute capabilities into their products of all shapes and sizes. From off-the-shelf compute modules to complete, custom-built systems, Tria makes technology for the world’s best products. With in-house design and manufacturing and a global footprint, Tria is uniquely positioned to support large multinational OEMs.
The Power of Three
Select from the largest range of embedded compute modules, single-board computers and system building blocks, developed with the world's leading processor brands.
Design your product with our world-class technology experts, who work across our technology campuses and bring even the most complex designs to life.
Seamlessly transition from design to manufacturing at one of our state-of-the-art sites with our dedicated project teams and global logistics network.
Why Choose Tria?
OEMs trust Tria to help them get their product to market faster, better and stronger.
Faster, by speeding up development time with verified designs and modular solutions.
Better, by leveraging the latest cutting-edge compute and display technology.
Stronger, with a global integrated supply chain and reduced costs.
Our Capabilities:
- Compute modules (industry standard & proprietary)
- Single-board computers (SBCs)
- Full System Integration
- Human Machine Interfaces (HMIs)
- Full Custom Compute Design
- In-house Compute Manufacturing & System Assembly
- Display & Touchscreen
- Design and Integration
- BIOS, Firmware, OS & Software
- Customization and Pre-loading
- OEM Production Line Integration
- In-house Research, Development & Design
- Global Logistics & Extended Manufacturing
- Europe-based Manufacturing
- Advanced Automation
- Quality Control (highest standards)
- Long-Term Support & Product Longevity
Browse our modules
Latest news

Tria rocks Embedded World debut with launch of COM Express Compact Type 6 module
Tria launches the C6C-RYZ8 COM Express Compact Type 6 module at Embedded World 2025. Powered by AMD Ryzen™ Embedded 8000 Series with integrated AI acceleration, the module brings scalable x86 performance to compact embedded systems.

Tria introduces first HMM-RLP module featuring COM-HPC Mini form factor at Embedded World 2025
Tria introduces its first COM-HPC Mini form factor module—HMM-RLP—powered by 13th Gen Intel® Core™ processors. Designed for edge compute performance in space-constrained systems, the module debuts at Embedded World 2025.

Tria to launch five new product families powered by Qualcomm at Embedded World
At Embedded World 2025, Tria Technologies will launch five new embedded module families powered by Qualcomm Dragonwing™ and Snapdragon® platforms. Designed for edge AI, low power, and industrial performance, these modules enable next-generation IoT and embedded applications.

Tria debuts at Embedded World 2025 with new product launches
Tria Technologies™, an Avnet company specialising in embedded compute boards, is making its Embedded World debut in Hall 3A Booth 225.