Avnet Embedded presents COM-HPC modules based on 12th Gen Intel® Core™ processors for high-performance computing
Stutensee, Germany – June, 2022 – Avnet Embedded expands its COM-HPC product portfolio for high-performance computing applications and presents the new MSC HCA-ALP client module family in Hall 3, Booth 135 at embedded world 2022. The powerful computer-on-modules integrate an 12th Gen Intel® Core™ processor and are scalable up to high-end processors with fourteen cores and twenty threads. The client interface offers two 2.5GbE Ethernet ports, PCI Express™ interfaces and USB ports, and several graphics interfaces.
Avnet Embedded’s MSC HCA-ALP client module family is suitable for demanding applications like sophisticated instrumentation, high-end medical equipment, transportation and logistics systems, intelligent video surveillance, and professional gaming solutions.
The MSC HCA-ALP modules correspond to the COM-HPC Client size A form factor and have dimensions of 120 x 95 mm. The module height is determined by the cooling solutions, which depend on the thermal requirements.
For a first evaluation of the high-performance computing modules, for rapid prototyping and for fast application development, Avnet Embedded provides an appropriate COM-HPC client carrier board and comprehensive design support. The complete ecosystem allows getting early access to the new PICMG standard and once again underscores Avnet Embedded’s leading role as a manufacturer of innovative embedded products.
Avnet Embedded develops and manufactures its COM-HPC products in Germany. This requires decentralized design centers, which have built up extensive know-how in the development of embedded solutions, and the company’s own fully automated production facilities. A very high quality of the Computer-On-Modules (COMs) and a long availability of 15 years are thus guaranteed.
Technical specifications:
Avnet Embedded’s powerful MSC HCA-ALP COM-HPC module family is equipped with 12th Gen Intel® Core™ H-series, P-series and U-series processors (codenamed „Alder Lake U/P/H-series“). The new Intel® performance hybrid architecture features Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP). Applications requiring lower power dissipation can be operated with selected processor variants at 12W TDP. The integrated Intel® Iris® Xe Architecture Graphics with up to 96 execution units (EUs) ensures high graphics performance.
For highest data throughput the MSC HCA-ALP modules enable fast DDR5-4800 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from 8 to
64 GB.
The COM-HPC carrier board can be connected to the module via up to eight PCIe Gen 3 lanes, up to eight PCIe Gen 4 lanes and an optional eight lane PEG port capable of PCIe Gen 4. The two Ethernet interfaces provide up to 2.5GbE bandwidth each based on the Intel® i225/i226 network controller family. Further high-speed I/O can utilize USB ports featuring USB 4 and USB 3.2.
Display interfaces include three DisplayPort/HDMI interfaces and an Embedded DisplayPort interface. The powerful MSC HCA-ALP modules can drive up to four independent displays. Mass storage devices can be connected via two SATA 6 Gb/s channels. Optionally, the computer-on-modules are equipped with up to 1 TB NVMe SSD.
For more information, please visit: https://www.tria-technologies.com/products/msc-hca-alp/
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