Intel Core processors on COM Express and COM-HPC computing platforms: high performance for AI applications
To support the development of demanding industrial products, Avnet Embedded offers a broad portfolio of innovative embedded computing modules based on powerful 13th and 12th Gen Intel Core series processors.
We have expanded our embedded computing portfolio with a number of new COM-HPC™, COM Express™, SMARC™ and OSM™ module families to offer early access to new processor technologies for future applications. The ready-to-use Computer-on-Modules integrate a core processor functionality and are simply mounted on a carrier board that has all application-specific functions. The module concept offers open scaling and high flexibility to optimize project costs when compared with the time-to-market of custom designed products. These standardized embedded compute modules also offer easy migration to future new technologies.
This broad portfolio of innovative embedded computing modules can cover all the requirements of current applications, thanks to their scalable performance and a flexible feature set. We are pleased to be able to offer our customers access to an entire ecosystem: starter kit, board support package and design-in support which allows for easy implementation of the new processor technologies. These services range from adaptation of the BIOS and support in development of the carrier board to integration of the module into the special application. In addition, we can offer the ability to manufacture not only modules, but also complete assemblies and systems according to our customers’ specifications.
To meet the high-performance demands of data intensive applications, we have also introduced powerful embedded module families based on the new 13th Gen Intel® Core™ series processors (formerly codenamed: Raptor Lake) and 12th Gen Intel Core series processors (formerly codenamed Alder Lake). The product portfolio offers innovative standard modules in three form factors to offer an optimized solution for each application:
- COM-HPC
- COM Express type 6 Basic (125 x 95mm)
- COM Express type 6 Compact (95 x 95mm)
The scalable product families offer a wide selection of CPU variants, giving application designers a great variety of choices in power efficient and performant compute solutions. The 13th Gen Intel® Core™ series processor family is socket-compatible with the 12th Generation and can be integrated into existing architectures. This enables PCIe Gen 5 graphics applications based on COM-HPC that further expand I/O bandwidth, among other benefits.
“Allowing our customers to accelerate the integration of innovative computing capabilities into their products is a priority for us. Our powerful COM-HPC and COM Express module families are a key component for the development future high-performance computing applications.”
Typical applications of high-performance module families demand quality, security and reliability, such as:
- Industrial automation systems
- Process control systems
- Powerful HMI terminals
- Professional measurement equipment
- Demanding medical equipment
- Transportation solutions
- Intelligent video surveillance solutions.
The 13th and 12th Gen Intel® Core™ processors integrate Intel’s Performance Hybrid Architecture which combines Performance-cores and Efficient-cores. The Intel® Thread Director provides intelligent workload optimization of the single cores. The architecture scales up to 14 cores and 20 threads. The integrated Intel® Iris® Xe Architecture Graphics with up to 96 EUs (Execution Units) ensure high graphics performance. The EUs support AI applications which are increasingly used in powerful image recognition and image processing systems.
These module families can also drive up to four independent displays and a selection of powerful interfaces (such as PCI Express® Gen 4/Gen 3 Lanes, Ethernet and USB 4 ports) ensures high data throughput.
Selected boards are ideal for tasks which are required to withstand 24/7 continuous operation and extended temperature ranges from -40 to +85°C. For industrial applications, grading options like Time Sensitive Networking (TSN) support, Intel® Time Coordinated Computing (TCC), and memory with In-Band Error Correction Code (IBECC) are also available.
Embedded modules in the new COM-HPC form factor are ideal for demanding powerful applications and offer the highest computing, graphics and video performance. The Avnet Embedded powerful MSC HCA-RLP COM-HPC module family is equipped with 13th Gen Intel® Core™ H-series, P-series and U-series processors. The boards correspond to the COM-HPC Client size A form factor and have dimensions of 120 x 95mm.
For highest data throughput the MSC HCA-RLP modules enable fast DDR5-4800 memory technology with up to 64GB SO-DIMM based memory and In-Band Error Correction Code. Module I/O comprises up to eight PCIe Gen 3 lanes, up to eight PCIe Gen 4 lanes and an optional eight lane PEG port capable of PCIe Gen 5. The two Ethernet interfaces provide up to 2.5GbE bandwidth each based on the Intel i226 network controller. Further high-speed I/O can utilize USB ports featuring USB4, USB 3.2, USB 2.0 and two UARTs. Display interfaces include three DisplayPort/HDMI interfaces and an Embedded DisplayPort. The modules can drive up to four independent displays. Mass storage devices can be connected via two SATA 6 Gb/s channels. Optionally, the Computer-on-Modules are equipped with up to 1TB NVMe SSD.
At the higher end of the performance range, we are expanding our broad COMe product portfolio and have announced the MSC C6B-RLP COM Express Type 6 module family. The scalable modules based on the 13th Gen Intel® Core™ H/P/U-series processors have a 45/35W thermal design power (TDP). For applications with demand for lower power consumption single processor variants are suited for 12W TDP.
The boards in the Basic form factor can be connected to the COM Express carrier board via eight PCIe Gen 4 and Gen 3 lanes and a 1×8 lane PEG port capable of PCIe Gen 4. The Ethernet interface based on the Intel® i226 network controller provides up to 2.5GbE bandwidth. Additionally, four USB 3.2 Gen 1/2 and eight USB 2.0 ports, two UARTs, three DisplayPort/HDMI interfaces and one LVDS and Embedded DisplayPort interface to control up to four independent displays are available on the boards. Mass storage devices are connected via two SATA 6Gb/s channels. Optionally, the Computer-on-Modules can be equipped with up to 1 TB NVMe SSD.
Avnet Embedded’s new MSC C6C-RLP COM Express Compact module family is based on 13th Gen Intel® Core™ processors with dimensions of 95 x 95mm and ideal for industrial applications which require outstanding performance on a small form factor.
Both COM Express and COM-HPC standards enable performance scaling and migrating to future technology upgrades. Avnet Embedded guarantees long-term availability of at least ten years for these innovative module families to protect customers’ system investments and to avoid new certification processes, such as those you might find in medical applications.
“With the continuous expansion of our powerful module portfolio, we are making a vast range available to customers,” says Tim Jensen. “Those who are looking to embed the best computing capabilities into their innovative products within an optimized time-to-market will find what they need with Avnet Embedded.”