Simply high performance for your demanding imaging applications
Tria launches COMe and COM-HPC modules based on Intel Core Ultra processors
We’ve added two new high-end embedded module families to our portfolio. The MSC C6B-MLH and MSC HCA-MLH are designed for demanding compute and graphics applications, and both integrate Intel Core Ultra series processors (formerly Meteor Lake). They’re a welcome high-end addition to our already rich computer on modules portfolio.
Both modules provide a performance upgrade and new functionality for embedded high-end system solutions compared to previous product generations. The boards can be equipped with Intel Core Ultra processors with up to 16 CPU cores and 22 threads combined with a Thermal Design Power (TDP) of 28 / 15W. The modules featuring the built-in Intel AI Boost neuronal processing unit (NPU) and the Intel Arc graphics processing unit (GPU) or Intel Graphics support compute intensive applications and AI-based project solutions.
These are powerful modules, well suited for system designers who are looking for a design platform that utilizes the full performance potential of the Intel Core Ultra processor. And one which allows for new technologies to be implemented within a short development time combined with optimized cost. Typical applications might include:
• High-end medical equipment such as ultrasound imaging
• Robotics
• Intelligent security appliances
• Casino gaming solutions.
The heavy use of AI based data analysis and image processing can significantly enhance capabilities of such applications.
Two platform choices are on offer: COM Express and COM-HPC. Both form factors feature scalable performance and a migration path to future technology upgrades. The MSC C6B-MLH module family, based on COM Express Type 6 with Basic form factor (125 x 95mm), is intended as a technology refinement for applications that have the module standard already integrated.
System architects who are targeting higher I/O bandwidth and connectivity can select the COM-HPC Client Size A MSC HCA-MLH module family. Embedded modules in the new COM-HPC form factor are suited for demanding and high performance computing applications, offering strong computing, graphics and video power. The broad selection of high-speed interfaces for high data rates allows for best connection of networks and local IO controllers.
For highest data throughput the MSC C6B-MLH and MSC HCA-MLH modules enable fast DDR5-5600 memory technology with up to 96GB and In-Band Error Correction Code (IBECC).
The selection of high-speed interfaces includes up to sixteen PCIe Gen 4 lanes and an eight lane PEG port (PCIe Gen 4 or PCIe Gen 5 with COM-HPC) for accessing external accelerators, NVMe storage, and I/O at high throughput. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i226 network controller. The COM-HPC board has a second Ethernet port providing for more bandwidth and connectivity between the module and carrier board. Three DisplayPort / HDMI interfaces and an LVDS (COMe) & Embedded DisplayPort interface are available. The boards can drive up to four independent displays. Mass storage can be connected via two SATA 6 Gb/s channels.
Implementing these new processor technologies with Tria is simple, as we offer a complete ecosystem for rapid prototyping and application development: starter kit, board support package and design-in support. Your investments are well protected, as both modules are designed and manufactured by Tria, which means both long-term availability and peace of mind.