MSC SM2S-IMX8MINI

The MSC SM2S-IMX8MINI module features NXP’s i.MX 8M Mini processors that are based on latest 14nm FinFET technology to allow high computing and graphics performance at very low power consumption combined with a high degree of functional integration.

MSC SM2S-IMX8MINI offers single-, dual- or quad-core ARM Cortex-A53 processors in combination with the ARM Cortex-M4 real-time processor and GC NanoUltra multimedia 2D/3D GPU. It provides fast LPDDR4 memory, up to 64GB eMMC Flash memory, Gigabit Ethernet, PCI Express, USB 2.0, an on-board Wireless Module as well as an extensive set of interfaces for embedded applications.

The module is compliant with the new SMARC™ 2.0 standard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the SM2S-IMX8MINI module, MSC provides a development platform and a starter kit. Support for Linux is available (Android support on request).

Highlights

  • Single, Dual or Quad core ARM Cortex-A53 Applications Processor up to 1.8GHz
  • ARM Cortex-M4 Real Time Processor at 400MHz
  • Vivante GC NanoUltra 2D/3D Graphics Processor
  • 1080p60 H.265 decode, 1080p60 H.264 encode (VPU not available on ”Mini Lite“)
  • Up to 4GB LPDDR4 SDRAM
  • Up to 64GB eMMC Flash
  • Dual-channel LVDS / MIPI-DSI x4 (optional)
  • MIPI CSI-2 Camera Interface
  • PCI Express x1 Gen. 2
  • 4x USB 2.0 Host interface
  • 1x USB 2.0 Host/Device interface
  • Up to 2x Gigabit Ethernet
  • Wireless Module (optional)
  • Micro SD Card Socket (optional)
  • MMC/SD/SDIO interface
  • 2x CAN interface (optional)
  • 2x I2S Audio Interface
  • UART, SPI, I2C
  • SMARC 2.0 Compliant

Specifications

Technology:ARM
Form Factor:SMARC Short Size
CPU:NXP i.MX 8M Mini ARM Cortex-A53 Applications Processor - i.MX 8M Mini Solo, single-core, 1.6 - 1.8GHz - i.MX 8M Mini Dual, dual-core, 1.6 - 1.8GHz - i.MX 8M Mini Quad, quad-core, 1.6 - 1.8GHz - i.MX 8M Mini SoloLite, single-core, 1.6 - 1.8GHz - i.MX
Chipset:SOC
RAM:Up to 4GB 3000MT/s LPDDR4 SDRAM, soldered
Flash:Up to 64GB eMMC Flash QSPI NOR Flash (optional)
Storage Interfaces:1x MMC/SD/SDIO 1x Micro SD Card Socket (optional)
USB:1x USB 2.0 Host/Client, 4x USB 2.0 Host or 1x USB 2.0 Host/Client, 1x USB 2.0 Host (optional)
Serial Interfaces:2x UART with 2-wire hand shake 2x UART w/o hand shake
Bus Interfaces:1x PCI Express x1 Gen.2 lanes* 4x I2C up to 400 Kbit/s 2x CAN 2.0B (optional)** 2x SPI (with two chip selects) * Please refer to section "Network Interfaces" ** CAN and SPI are mutual exclusive
Display Controller:Vivante GC NanoUlta 3D Graphics Processing Unit (GPU) 3D Graphics Acceleration, 1 shader, 6.4 GFLOPS OpenGL ES 1.0, 2.0 Video Processing Unit (not available on ”Mini Lite“) with hardware support for 1080p60 HEVC H.265, VP9, H.264, VP8 decode 1080
Display Interfaces:Dual-channel LVDS interface, 18 or 24 bit (up to 1920x1080); also usable as one single-channel LVDS interface (up to 1366x768) or MIPI-DSI Display Interface, 4 lanes, up to 1920x1080 @ 60fps (optional)
Network Interface:1x 10/100/1000BASE-T Ethernet 1x 10/100/1000BASE-T Ethernet (Intel i210, optional, PCI Express x1 is not available if this option is selected) HD Wireless Module SPB209A with 802.11ac / Bluetooth 5.0, soldered (optional)
Audio Interface:2x I2S Audio
Security Device:Advanced Security, Safety, and Reliability integrated in the SOC Trusted Platform Module (TPM) 2.0 (optional)
Miscellaneous:Watchdog Timer for system reset (programmable, 1s … 600s) Temperature compensated RTC 12x GPIO, configurable as input or output 64kbit ID EEPROM on I2C bus MIPI CSI-2 camera interface (CSI0, 2 lane) or MIPI CSI-2 camera interface (CSI1, 4-lane)
Feature Highlights:NO Feature Highlights
OS Support:Linux Board Support Package Android Board Support Package (on request)
Power Requirement:Power Supply +5V +/-5%, 5V Standby Power Consumption 2-5 W typ. (depending on CPU and optional features)
Environment:Temperature Range: 0°C … +70°C operating commercial -40°C … +85°C operating extended -40°C … +85°C storage Humidity: 5 … 95% (operating, non condensing) 5 … 95% (storage, non-condensing)
Dimensions:82 x 50 mm
Certificates:UL / CE
Cooling:Heatspreader
Carrier:MSC SM2-MB-EP1

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