MSC SM2S-RYZ2

The MSC SM2S-RYZ2 module is the smallest embedded platform for the AMD Ryzen Embedded R2000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained space, power and cooling. The configurable Thermal Design Power (TDP) ranges from low 12 W to 15 W. The integrated Radeonâ„¢ Graphics with up to 8 Compute Units stands for highest graphics performance.

The new MSC SM2S-RYZ2 drives up to 4 independent 4k displays and offers up to 8 GByte fast DDR4 2667MT/s memory, USB 3.1/2.0 and PCI Express Gen.3 on a power saving and cost-efficient SMARC 2.1.1 Short Size module.

Different SOCs with quad-core (4/8 threads) and dual-core (4 threads) processors are supported by this design. In addition to an extensive set of interfaces it features hardware based security compliant to the requirements of TCG (Trusted Computing Group) and TPM 2.0 capability.

For evaluation and design-in of the MSC SM2S-RYZ2 module, Avnet Embedded provides a suitable SMARC 2.1.1 development platform.

Highlights

  • AMD Ryzenâ„¢ Embedded R2514, quad-core (8 threads) 2.1/3.7GHz, 15W (12-35W TDP)
  • AMD Ryzenâ„¢ Embedded R2314, quad-core (4 threads) 2.1/3.5GHz, 15W (12-35W TDP)
  • AMD Ryzenâ„¢ Embedded R2312, dual-core (4 threads) 2.7/3.5GHz, 15W (12-25W TDP)
  • Integrated AMD Radeonâ„¢ GPU with up to 8 Compute Units
  • Up to 8GB DDR4 2667MT/s SDRAM
  • Up to 256GB eMMC Flash
  • SATA-III interface (6Gbps)
  • Dual DisplayPort++ interface
  • LVDS / Embedded DisplayPort
  • OpenGL 4.6, OpenCL
  • Dual/Triple/Quad Independent Display support up 4k resolution (SKU related)
  • Up to 4x PCI Express x1 Gen. 3
  • 2x USB 3.1 Host interfaces
  • 4x USB 2.0 Host interfaces
  • Up to 2x Gigabit Ethernet
  • UART, SPI, I2C, SMBus, HD Audio
  • Trusted Platform Module (optional)
  • SMARC 2.1.1 compliant
  • UEFI Firmware

Specifications

Technology:x86
Form Factor:SMARCâ„¢ Short Size
CPU:AMD Ryzenâ„¢ Embedded R2514, quad-core (8 threads) 2.1/3.7GHz, 8 GPU CU, 15W (12-35W TDP) AMD Ryzenâ„¢ Embedded R2314, quad-core (4 threads) 2.1/3.5GHz, 6 GPU CU, 15W (12-35W TDP) AMD Ryzenâ„¢ Embedded 2312, dual-core (4 threads) 2.7/3.5GHz, 3 GPU CU
Chipset:Integrated in SOC
RAM:Up to 8GB 2667MT/s DDR4 SDRAM (2400MT/s with R2312)
Flash:Up to 256GB eMMC V5.0 Flash, soldered (optional)
Storage Interfaces:1x SATA-III 6Gbps
USB:4x USB 2.0 Host interfaces 2x USB 3.1 Host interface
Serial Interfaces:4x UART
Bus Interfaces:Up to 4x PCI-Express x1 Gen. 3 lanes 1x I2C Bus 1x SPI Bus 1x SMBus
Display Controller:AMD Radeonâ„¢ GPU with up to 8 Compute Units 4 independent displays supported (3 independent displays with R2312)
Display Interfaces:2 x DisplayPort++ Dual-channel LVDS / 2 x eDP 1.4 Up to 4x Digital Display Interfaces with up to 4k (3840 x 2160) resolution
Network Interface:Up to 2x 10/100/1000Base-T (Intel i210)
Audio Interface:High Definition Audio
Security Device:Infineon Trusted Platform Module 2.0 (optional)
Miscellaneous:Watchdog Timer: Initiates system reset, (programmable, 1s … 255h) Fan Supply: PWM Speed Control for system fan on carrier board RTC battery: external System Monitoring: Voltage, Temperature, CPU Fan, System Fan
Feature Highlights:SMARCâ„¢ 2.1.1 compliant
Firmware:AMI Aptio UEFI
OS Support:Windows 10 21H2 LTSC Windows 11 21H2 GAC Linux, Yocto
Power Requirement:+5V +/-5%
Environment:Temperature Range: 0° … 60°C (operating) -40° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing)
Dimensions:82 x 50 mm
Certificates:UL / CE
Cooling:Heatspreader Heatsink
Carrier:MSC SM2-MB-EP1

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