MSC SM2S-EL
The new MSC SM2S-EL module features Intel’s next-generation low-power, multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lake”). Built on 10nm process technology the SoC integrates the next generation Intel Atom processor core architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The module is designed for extended temperature range and 24/7 operation making it an ideal platform for mission critical tasks that require a reliable and performant compute base. It provides significant performance gains over previous Atom generations allowing for technology upgrades within existing power and cooling requirements defined by the system design.
The new MSC SM2S-EL offers triple independent display support with a maximum of 4k resolution, DirectX 12, fast LPDDR4x memory with up to 16GB and optional IBECC capabilities, eMMC 5.1, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient SMARC 2.1.1 Short Size module.
Different SOCs with dual- and quad-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC SM2S-EL offers 2 Gigabit Ethernet with Time-Sensitive Networking (TSN) and 2 CAN-FD interfaces.
For evaluation and design-in of the MSC SM2S-EL module, Avnet Embedded provides a suitable SMARC 2.1.1 development platform. A complete, ready-to-run Starterkit is also available.
Highlights
- Intel Atom x6xxxRE, Real-time Embedded SKU´s, dual/quad-core (6W-12W)
- Intel Atom x6xxxE, Embeddded SKU´s, dual/quad-core (6W-12W)
- Intel Pentium/Celeron J64xx, PC Client SKU´s,quad-core (6W-12W)
- Intel Pentium/Celeron N6xxx, PC Client SKU´s, dual/quad-core (6W-12W)
- Integrated Intel UHD Graphics (Gen11)
- Up to 16GB LPDDR4x SDRAM with IBECC (only Atom SKU´s)
- Up to 256GB eMMC 5.1, Flash (optional)
- SATA-III interface (6Gbps)
- 1x DisplayPort 1.4 / HDMI™ 2.0b
- 1x DisplayPort 1.4
- LVDS / Embedded DisplayPort and MIPI-DSI
- Triple Independent Display support
- DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan v1.1
- Up to 4x PCI Express x1/x2/x4 Gen. 3
- 2x USB 3.1 Host interfaces (1x Host/Device)
- 6x USB 2.0 Host interfaces (1x Host/Device)
- 2x Gigabit Ethernet with TSN/TCC
- 1x SGMII Interface on PCIE-D (optional)
- UART, SPI, I2C, SMBus
- 2x CAN-FD
- HD/I2S Audio, SD Card interface
- Trusted Platform Module (optional)
- SMARC 2.1 compliant
- UEFI Firmware
Specifications
Technology | x86 |
Form Factor | SMARC™ Short Size |
CPU | Intel Atom x6425RE Processor, quad-core, 1.9GHz, 32EU, TCC, IBECC, 12W, IUC Intel Atom x6416RE Processor, quad-core, 1.7GHz, 16EU, TCC, IBECC, 9W, IUC Intel Atom x6414RE Processor, quad-core, 1.5GHz, 16EU, TCC, IBECC, 9W, IUC Intel Atom x6214RE Processor, dual-core, 1.4GHz, 16EU, TCC, IBECC, 6W, IUC Intel Atom x6212RE Processor, dual-core, 1.2GHz, 16EU, TCC, IBECC, 6W, IUC Intel Atom x6425E Processor, quad-core, 2.0/3.0GHz, 32EU, IBECC, 12W, EUC Intel Atom x6413E Processor, quad-core, 1.5/3.0GHz, 16EU, IBECC, 9W, EUC Intel Atom x6211E Processor, dual-core, 1.3/3.0GHz, 16EU, IBECC, 6W, EUC Intel Pentium J6426 Processor, quad-core,2.0/3.0GHz, 32EU, 10W, PUC Intel Pentium N6415 Processor, quad-core, 1.2/3.0GHz, 16EU, 6W, PUC Intel Celeron J6413 Processor, quad-core, 1.8/3.0GHz, 16EU, 10W, PUC Intel Celeron N6211 Processor, quad-core, 1.2/3.0GHz, 16EU, 6W, PUC Intel® Technologies: Enhanced Intel® SpeedStep® Technology Intel® Virtualization Technology (VTx-2, VT-d) Intel® Trusted Execution Engine (TXE) Intel® Time Coordinated Computing (TCC) Precision Time Measurement (PTM) Precision Time Measurement (PTP) IUC - Intel Industrial Use Conditions EUC - Intel Embedded Use Conditions PUC - Intel PC Client Use Conditions |
Chipset | Integrated in SOC |
RAM | Up to 16GB LPDDR4x SDRAM, up to 4267MT/s, IBECC (only Atom SKU´s), soldered |
Flash | Up to 256GB eMMC V5.1 Flash, soldered (optional) |
Storage Interfaces | 1x SATA-III 6Gbps 1x SD 3.01/SDIO 3.0 |
USB | 2x USB 3.1 Host interfaces (1x Host/Device) 6x USB 2.0 Host interfaces (1x Host/Device) |
Serial Interfaces | 4x UART (two with handshake) |
Bus Interfaces | Up to 4x PCI-Express x1 Gen. 3 lanes 1x I2C Bus 1x SPI Bus (Boot) 1x SPI Bus (general purpose)/ eSPI (optional) 1x SMBus 2x CAN-FD (Flexible Data-Rate) |
Display Controller | Integrated Intel UHD Graphics (Gen11) Up to 32 execution units (EU) 3D Acceleration: DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan 1.0 Video Decode: MPEG-2, H.265/HEVC (L5.1), H.264, (L5.2), VC-1, WMV9, VP8, VP9, MVC, JPEG/MJPEG |
Display Interfaces | Three independent displays supported 2x DP++ Dual-Channel LVDS 24/18 bit up to 1920 x 1200 @ 60Hz or Embedded DisplayPort 1.3 up to 4096 x 2160 @ 60Hz and MIPI-DSI x4 Interface up to 2560 x 1600 @ 60Hz (optional) |
Network Interface | 2x 10/100/1000Base-T 1x SGMII Interface on PCIE-D (optional) |
Audio Interface | High Definition Audio and I2S Audio or 2x I2S Audio |
Security Device | Infineon Trusted Platform Module 2.0 (optional) |
Miscellaneous | Watchdog Timer: Initiates system reset, (programmable, 1s … 255h) Fan Supply: PWM Speed Control for system fan on carrier board RTC battery: external System Monitoring: Voltage, Temperature, CPU Fan, System Fan |
Feature Highlights | SMARC™ 2.1 compliant |
Firmware | AMI Aptio UEFI |
OS Support | Windows 10 IoT Enterprise RS5 (64bit) Windows 10 IoT Core RS5 (64bit) Linux (Yocto Project) |
Power Requirement | +5V +/-5% +5V Standby |
Environment | Temperature Range: 0° … 60°C (operating) -25° … 85°C (storage) -40° … 85°C (operating industrial) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing) |
Dimensions | 82 x 50 mm |
Certificates | UL / CE |
Cooling | Heatspreader Heatsink |
Carrier | MSC SM2-MB-EP1 |
Order Info
Order No. | Description | Reference | Status |
88129 | SMARC 2.1.1 module with Intel Atom x6425RE, Quad-Core (1.9GHz), 12W,16GB LPDDR4x (3200 MT/s) IBECC, 32EU, TCC, 64GB eMMC, 2x GbELAN, 1x SATA, 2xUSB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0,LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C | MSCSM2S-EL-x6425RE-46N0281IPCBFTX | PV |
87436 | SMARC 2.1.1 module with Intel Atom x6425RE, Quad-Core (1.9GHz), 12W,4GB LPDDR4x (3733 MT/s) IBECC, 32EU, TCC, 4GB eMMC, 2x GbELAN, SGMII on PCIe_D, no SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1xHost/Device), 2x DP++, TPM 2.0, eDP, IUC (Industrial use conditions),extended temperature -25°C...+85°C | MSCSM2S-EL-x6425RE-22N0191EPCBFTX | OR |
88125 | SMARC 2.1.1 module with Intel Atom x6414RE, Quad-Core (1.5GHz), 9W,4GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, 32GB eMMC, 2x GbELAN, SGMII on PCIe_D, no SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1xHost/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrialtemperature -40...+85°C | MSCSM2S-EL-x6414RE-25N0291IPCBFTX | PV |
88121 | SMARC 2.1.1 module with Intel Atom x6212RE, Dual-Core (1.2GHz), 6W,4GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, 16GB eMMC, 2x GbELAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0,LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°C | MSCSM2S-EL-x6212RE-24N0281IPCBFTX | PV |
88127 | SMARC 2.1.1 module with Intel Atom x6425E, Quad-Core (2.0GHz/3.0GHz),12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, 64GB eMMC, 2x GbELAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0,LVDS, EUC (Embedded use conditions),extended temperature -25°C...+85°C | MSCSM2S-EL-x6425E-46N0281EPCBFTX | PV |
88123 | SMARC 2.1.1 module with Intel Atom x6413E, Quad-Core (1.5GHz/3.0GHz),9W, 8GB LPDDR4x (3733 MT/s), IBECC, 16EU, 32GB eMMC, 2x GbELAN, SGMII on PCIe_D, no SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1xHost/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extendedtemperature -25°C...+85°C | MSCSM2S-EL-x6413E-35N0291EPCBFTX | PV |
88119 | SMARC 2.1.1 module with Intel Atom x6211E, Dual-Core (1.3GHz/3.0GHz),6W, 4GB LPDDR4x (3733 MT/s), IBECC, 16EU, 16GB eMMC, 2x GbELAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0,LVDS, EUC (Embedded use conditions),extended temperature -25°C...+85°C | MSCSM2S-EL-x6211E-24N0281EPCBFTX | PV |
88116 | SMARC 2.1.1 module with Intel Pentium J6426, Quad-Core (2.0GHz/3.0GHz), 10W, 16GB LPDDR4x (3200 MT/s), 32EU, 64GB eMMC, 2xGbE LAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device),TPM 2.0, LVDS, PUC (PC Client use conditions), standard temperature0...+60°C | MSCSM2S-EL-J6426-46N0281CPCBFTX | PV |
88114 | SMARC 2.1.1 module with Intel Celeron J6413, Quad-Core (1.8GHz/3.0GHz), 10W, 8GB LPDDR4x (3733 MT/s), 16EU, 16GB eMMC, 2x GbELAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, PUC (PC Client use conditions), standardtemperature 0...+60°C | MSCSM2S-EL-J6413-34N0281CPCBFTX | PV |
96349 | SMARC 2.1.1 module with Intel Atom x6413E, Quad-Core (1.5GHz/3.0GHz),9W, 4GB LPDDR4x (3733 MT/s), IBECC, 16EU, 128GB eMMC, 2x GbE LAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), industrial temperature -40...+85°C | 2MSC SM2S-EL-x6413E-27N0281I PCBFTX | PV |
90305 | SMARC 2.1.1 module with Intel Atom x6414RE, Quad-Core (1.5GHz), 9W, 4GB LPDDR4x (3733 MT/s) IBECC, 32EU, TCC, 4GB eMMC, 2x GbE LAN, SGMII on PCIe_D, no SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), 2x DP++, TPM 2.0, eDP, IUC (Industrial use conditions), extended temperature -25°C...+85°C | MSC SM2S-EL-x6414RE-22N0191E PCBFTX | PV |
110394 | SMARC 2.1.1 module with Intel Atom x6413E, Quad-Core (1.5GHz/3.0GHz),9W, 4GB LPDDR4x (3733 MT/s), IBECC, 16EU, 32GB eMMC, 2x GbELAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), industrialtemperature -40...+85°C | MSC SM2S-EL-x6413E-25N0180I PCBFTX | PV |
111756 | SMARC 2.1.1module with Intel Atom x6425E, Quad-Core (2.0GHz/3.0GHz), 12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, no eMMC, 2x GbE LAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25...+85°C | MSC SM2S-EL-x6425E-4NN0281E PCBFTX | PV |
111991 | SMARC 2.1.1 module with Intel Atom x6414RE, quad-core (1.5GHz), 9W,8GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, no eMMC, 2x GbE LAN,1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device),LVDS, TPM 2.0, IUC (Industrial use conditions), industrial temperature-40...+85°C | MSCSM2S-EL-x6414RE-3NN0281IPCBFTX | PV |
Accessories
Carrier Options
Order No. | Description | Reference |
68488 | SMARC 2.0 Embedded Platform with PCI Express x4 slot, GbE, SATA, USB 3.0, USB 2.0, USB 2.0 OTG, RS232, CAN, SPI, eSPI, SMBus, I2C and GPIO interface, LVDS/eDP, DisplayPort and HDMI display interface, regulated backlight supply, HD/I2S audio interface, MIPI CSI-2 camera interface, mini PCI Express card slot, SD card slot, fan connector, CMOS battery, Mini-ITX form factor (170 x 170 mm), ATX power connector and single 12V/24V power jack, commercial temperature range 0..+70°C | MSC SM2-MB-EP1-001 PCBFTX |
85087 | SMARC 2.x compatible embedded platform (146 x 80mm), 10-36V input voltage, 3x RS232, 1x RS485, dual RJ45 LAN with LED (1 x LAN i210), 1x M.2 2280 Key M slot, mPCIe slot, 1x USB 3.0 Type A, 1x USB 3.0/ DisplayPort Type C , 1x USB 2.0 Type A, 1x USB 2.0 internal, 1x μUSB 2.0 Host/Device, 2x SPI, I²C, 12 GPIO on FC, 1x DisplayPort++ , LVDS/ eDP/DSI on JILI30 connector, μSD Card Slot, regulated backlight supply, HD Audio with amplifier, system fan connector, camera connector, RTC battery. Industrial temperature range -40..+85°C, x86 full version | MSC SM2S-MB-EP5-001 PCBFTX |
83979 | SMARC 2.x compatible embedded platform (146 x 80mm), 12V input voltage, 3x RS232, 1x RS485, dual RJ45 LAN with LED, 1x M.2 2280 Key M slot , 1x USB 2.0 Type A, 1x USB3.0 Type A, 1x USB 2.0 internal, 1x μUSB 2.0 Host/Device, 2x SPI, 12 GPIO on FC, 1x DisplayPort++ , LVDS/eDP/DSI on JILI30 connector, regulated backlight supply, RTC battery, Industrial temperature range -40..+85°C, x86 slim version | MSC SM2S-MB-EP5-003 PCBFTX |
Cooling Options
Order No. | Description | Reference |
82414 | Passive Heatsink for SM2S-EL variants with Atom processor, consisting of a single-piece aluminium pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC SM2S-EL-01 HSI-001 |
85122 | Heatspreader for SM2S-EL variants with Atom processor, consisting of a single-piece aluminium plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC SM2S-EL-01 HSP-001 |
88512 | Passive Heatsink for SM2S-EL variants with Pentium/Celeron processor, consisting of a single-piece aluminium pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC SM2S-EL-02 HSI-001 |
88511 | Heatspreader for SM2S-EL variants with Pentium/Celeron processor, consisting of a single-piece aluminium plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffs | MSC SM2S-EL-02 HSP-001 |
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