MSC C6B-CFLH

The MSC C6B-CFLH module is based on the 8th Generation Intel® Core™ Processor family. The Intel two-chip solution allows highest performance in graphics and computing on a COM Express module in basic form factor. The new MSC C6B-CFLH offers triple independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory with optional error correction (ECC) and multiple USB 3.1/2.0 interfaces complete the compact and powerful module. With choices of six and quad-core processor options the board is well positioned to address challenging performance demands. Besides an extensive set of interfaces and features, the MSC C6B-CFLH offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort 1.4, DisplayPort 1.2, HDMI 1.4 and DVI as well as up to four USB 3.1 interfaces supporting the fastest peripherals currently available.

Highlights

  • Intel® Core™ i5-8400H (quad-core, 2.5/4.2GHz, 45/35W cTDP)
  • Intel® Core™ i3-8100H (quad-core, 3.0GHz, 45/35W cTDP)
  • Intel® Xeon® E-2176M (six-core, 2.7/4.4GHz, 45/35W cTDP),
  • Intel® UHD Graphics
  • Intel® chipsets QM370 or CM246
  • Up to 32GB DDR4-2666 SDRAM, dual channel (ECC optionally supported on models with Xeon E-2176M)
  • Four SATA 6Gb/s mass storage interfaces
  • Three DisplayPort/HDMI/DVI interfaces
  • Embedded DisplayPort / LVDS (24 Bit, dual channel) interface
  • Triple Independent Display support
  • DirectX 12, OpenGL 4.5, OpenCL 2.x
  • Resolution up to 4096 x 2304
  • Eight PCI Express™ x1 lanes, configurable up to x4, Intel® Rapid Storage Technology support
  • PEG configurable as 1×16 or 2×8 or 1×8 + 2×4
  • Four USB 3.1/2.0 and four USB 2.0 interfaces
  • Trusted Platform Module
  • UEFI Firmware

Specifications

Technologyx86
Form FactorCOM Express Basic
CPUIntel® Core™ i7-8850H (six-core, 2.6/4.3GHz, 9M cache, 45/35W cTDP), Intel® Core™ i5-8400H (quad-core, 2.5/4.2GHz, 8M cache, 45/35W cTDP), Intel® Core™ i3-8100H (quad-core, 3.0GHz, 6M cache, 45/35W cTDP), Intel® Xeon® E-2176M (six-core, 2.7/4.4GHz, 12M cache, 45/35W cTDP), Intel® Technologies: Intel® vPro, Intel® 64, Intel® Virtualization Technology (VT-x), Intel® Virtualization Technology for Directed I/O (VT-d), Intel® Trusted Execution Technology*, Intel® Adv. Encryption Standard AES-NI, Intel®Turbo Boost Technology 2.0 * not on all models
ChipsetIntel® Platform Controller Hubs (PCH) QM370 or CM246
RAM2x 260-pin SO-DIMM socket for up to 2x 16GB DDR4 SDRAM (DDR4-2666¹) dual channel operation ECC option¹² ¹ Depending on SO-DIMM type ² ECC supported on models with Xeon E-2176M
Storage Interfaces4x SATA channels (up to 6Gb/s)
USB4x USB 3.1 (Gen 1 & 2)/2.0,

4x USB 2.0
Serial Interfaces2x high-speed serial ports from PCH
Bus Interfaces8x PCI Express x1 Gen 3, 1x PCI Express Graphics (PEG) x 16 Gen. 3 LPC bus (Low Pin Count bus no DMA support)
Display ControllerIntegrated Intel UHD graphics Gen. 9 3D Acceleration: DirectX® 11/12, OpenGL 4.3/4.4, OpenGL ES 2.0, OpenCL 2.x HW accelerated Video Decode: H.264/AVC, VP8, VP9, VP9 10 Bit, H.265/HEVC 8 bit, H.265/HEVC 10 Bit, MPEG2, MJPEG, VC-1 HW accelerated Video Encode: H.264/AVC, VP8, VP9, H.265/HEVC 8 bit, H.265/HEVC 10 Bit, MPEG2, MJPEG. Triple independent display support
Display InterfacesDisplay Port and HDMI/DVI: 3x Digital Display Interface, usable as DisplayPort 1.2 (up to 4096 x 2304 @ 60Hz), also usable as HDMI 1.4b or DVI (up to 4096 x 2160 @ 30Hz) 1x Embedded DisplayPort 1.4 (on variants without LVDS only) 4096 x 2304 @ 60Hz LCD: LVDS 24bit, dual-channel (not on all variants) 1920 x 1200 @ 60Hz
Network Interface10/100/1000Base-TX (integrated in PCH, Intel® i219LM PHY)
Audio InterfaceHigh Definition Audio
Security DeviceTPM 2.0
MiscellaneousWatchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for 12V CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: External System Monitoring: Voltage, temperature, CPU fan, system fan
FirmwareUEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management: ACPI Active fan control USB: USB legacy support (keyboard, mouse, storage) Monitoring: System Monitoring Health Monitoring MSC Adv. Boot Device Selection: Boot device priority setting based on physical interfaces
OS SupportWindows 10 IOT Enterprise BSP for Linux (Yocto) EAPI (HW Programming Interface)
Power RequirementVoltage: +8.5V to +20V, +5V Stby optional Power Consumption: 35 W to 55 W (typ.)
EnvironmentAmbient Temperature 0° … 60°C (operating), -25° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing)
Dimensions125mm x 95mm x 13mm* (*Measured from module PCB bottom side to heat spreader top side. Different heights apply, when using other cooling solutions.)
CertificatesUL / CE
CoolingCertificates

Order Info

Order No.DescriptionReferenceStatus
73872COM Express Type 6 Basic module (125mm x 95mm) CPU: Intel Xeon E-2176M, six-core, 2.7/4.4GHz, 45W TDP Chipset: CM246 Graphics: integrated Intel HD Gen 9 (GT2) Embedded DisplayPort (eDP) 3x DP/HDMI/DVI Ethernet: Intel i219 Gbit HD audio 4x SATA 4x USB3.1/2, 4x USB2 8x PCIe x1 Gen 3 PEG x16 Gen 3 2x socket for DDR4 or DDR4 ECC SO-DIMM TPM 2.0.MSC C6B-CFLH-2176M-NN1101C PCBFTXOR
73874COM Express Type 6 Basic module (125mm x 95mm) CPU: Intel Xeon E-2176M, six-core, 2.7/4.4GHz, 45W TDP Chipset: CM246 Graphics: integrated Intel HD Gen 9 (GT2) LVDS (24 Bit, dual channel) 3x DP/HDMI/DVI Ethernet: Intel i219 Gbit HD audio 4x SATA 4x USB3.1/2, 4x USB2 8x PCIe x1 Gen 3 PEG x16 Gen 3 2x socket for DDR4 or DDR4 ECC SO-DIMM TPM 2.0.MSC C6B-CFLH-2176M-NN1201C PCBFTX OR
73848COM Express Type 6 Basic module (125mm x 95mm) CPU: Intel Core i7-8850H, six-core, 2.6/4.3GHz, 45W TDP Chipset: QM370 Graphics: integrated Intel HD Gen 9 (GT2) Embedded DisplayPort (eDP) 3x DP/HDMI/DVI Ethernet: Intel i219 Gbit HD audio 4x SATA 4x USB3.1/2, 4x USB2 8x PCIe x1 Gen 3 PEG x16 Gen 3 2x socket for DDR4 SO-DIMM TPM 2.0.MSC C6B-CFLH-8850H-NN0101C PCBFTXPV
73850COM Express Type 6 Basic module (125mm x 95mm) CPU: Intel Core i7-8850H, six-core, 2.6/4.3GHz, 45W TDP Chipset: QM370 Graphics: integrated Intel HD Gen 9 (GT2) LVDS (24 Bit, dual channel) 3x DP/HDMI/DVI Ethernet: Intel i219 Gbit HD audio 4x SATA 4x USB3.1/2, 4x USB2 8x PCIe x1 Gen 3 PEG x16 Gen 3 2x socket for DDR4 SO-DIMM TPM 2.0.MSC C6B-CFLH-8850H-NN0201C PCBFTXPV
73876COM Express Type 6 Basic module (125mm x 95mm) CPU: Intel Core i5-8400H, quad-core, 2.5/4.2GHz, 45W TDP Chipset: QM370 Graphics: integrated Intel HD Gen 9 (GT2) Embedded DisplayPort (eDP) 3x DP/HDMI/DVI Ethernet: Intel i219 Gbit HD audio 4x SATA 4x USB3.1/2, 4x USB2 8x PCIe x1 Gen 3 PEG x16 Gen 3 2x socket for DDR4 SO-DIMM TPM 2.0.MSC C6B-CFLH-8400H-NN0101C PCBFTXPV
73878COM Express Type 6 Basic module (125mm x 95mm) CPU: Intel Core i5-8400H, quad-core, 2.5/4.2GHz, 45W TDP Chipset: QM370 Graphics: integrated Intel HD Gen 9 (GT2) LVDS (24 Bit, dual channel) 3x DP/HDMI/DVI Ethernet: Intel i219 Gbit HD audio 4x SATA 4x USB3.1/2, 4x USB2 8x PCIe x1 Gen 3 PEG x16 Gen 3 2x socket for DDR4 SO-DIMM TPM 2.0.MSC C6B-CFLH-8400H-NN0201C PCBFTXPV
76724COM Express Type 6 Basic module (125mm x 95mm) CPU: Intel Core i3-8100H, quad-core, 3.0GHz, 45W TDP Chipset: QM370 Graphics: integrated Intel HD Gen 9 (GT2) Embedded DisplayPort (eDP) 3x DP/HDMI/DVI Ethernet: Intel i219 Gbit HD audio 4x SATA 4x USB3.1/2, 4x USB2 8x PCIe x1 Gen 3 PEG x16 Gen 3 2x socket for DDR4 SO-DIMM TPM 2.0.MSC C6B-CFLH-8100H-NN0101C PCBFTX PV
76728COM Express Type 6 Basic module (125mm x 95mm) CPU: Intel Core i3-8100H, quad-core, 3.0GHz, 45W TDP Chipset: CM246 Graphics: integrated Intel HD Gen 9 (GT2) Embedded DisplayPort (eDP) 3x DP/HDMI/DVI Ethernet: Intel i219 Gbit HD audio 4x SATA 4x USB3.1/2, 4x USB2 8x PCIe x1 Gen 3 PEG x16 Gen 3 2x socket for DDR4 or DDR4 ECC SO-DIMM TPM 2.0.MSC C6B-CFLH-8100H-NN1101C PCBFTXOR
76726COM Express Type 6 Basic module (125mm x 95mm) CPU: Intel Core i3-8100H, quad-core, 3.0GHz, 45W TDP Chipset: QM370 Graphics: integrated Intel HD Gen 9 (GT2) LVDS (24 Bit, dual channel) 3x DP/HDMI/DVI Ethernet: Intel i219 Gbit HD audio 4x SATA 4x USB3.1/2, 4x USB2 8x PCIe x1 Gen 3 PEG x16 Gen 3 2x socket for DDR4 SO-DIMM TPM 2.0.MSC C6B-CFLH-8100H-NN0201C PCBFTXPV
76730COM Express Type 6 Basic module (125mm x 95mm) CPU: Intel Core i3-8100H, quad-core, 3.0GHz, 45W TDP Chipset: CM246 Graphics: integrated Intel HD Gen 9 (GT2) LVDS (24 Bit, dual channel) 3x DP/HDMI/DVI Ethernet: Intel i219 Gbit HD audio 4x SATA 4x USB3.1/2, 4x USB2 8x PCIe x1 Gen 3 PEG x16 Gen 3 2x socket for DDR4 or DDR4 ECC SO-DIMM TPM 2.0.MSC C6B-CFLH-8100H-NN1201C PCBFTXOR

Accessories

Carrier Options

Order No.DescriptionReference
67295COM Express Type 6 Evaluation Carrier Board with PCI Express x4/x16 slot, USB 3.0/2.0, GbE, SATA, DisplayPort, eDP/LVDS, VGA and HD audio interfaces; Mini PCI Express socket, SD card slot, ATX power connector and single 12V power jack. Dimensions 170mm x 170mm (Mini-ITX form factor)MSC C6-MB-EV-001 PCBFTX
41857COM Express Type 6 Evaluation Carrier Board with various PCI Express x1, x4 and x16 slots, USB 3.0/2.0, GbE, SATA, DisplayPort, HDMI, LVDS, eDP, VGA, HD audio interfaces; mSATA and Mini PCI Express sockets, POST code display, ATX power connector. Dimensions 305 x 244 mm (ATX form factor)MSC C6-MB-EVA PCBFTX

Cooling Options

Order No.DescriptionReference
1131080Active Heatsink for C6B-SLH, C6B-KLH, C6B-CFLH and C6B-CFLR, consisting of a single-piece aluminum profile with fins, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU and chipset. PWM fan 80x80x15mm.MSC C6B-SLH-01 HSF-001
1131081Passive Heatsink for C6B-SLH, C6B-KLH, C6B-CFLH and C6B-CFLR, consisting of a single-piece aluminum profile with fins, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU and chipset.MSC C6B-SLH-01 HSI-001
1131082Heatspreader for C6B-SLH, C6B-KLH, C6B-CFLH and C6B-CFLR. Single-piece aluminum profile, pressed in standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU and chipset. No fan, no SO-DIMM cutout.MSC C6B-SLH-01 HSP-001
1131083Heatspreader for C6B-SLH, C6B-KLH, C6B-CFLH and C6B-CFLR. Single-piece aluminum profile, pressed in standoffs with M2.5 thread, screws and thermopads for the thermal contact to CPU and chipset. No fan, no SO-DIMM cutout.MSC C6B-SLH-02 HSP-001

Memory Options

Order No.DescriptionReference
9554916GB DDR4-2666 SO-DIMM, ECCMOD SODIMM DDR4 16GBPC4-21300 CL19 2B
8449516GB DDR4-2666 SO-DIMMMOD SODIMM DDR4 16GBPC4-21300 CL19 2B
8297032GB DDR4 2666 SO-DIMMMOD SODIMM DDR4 32GBPC4-21300 CL19 2B
830044GB DDR4-2666 SO-DIMM, ECCMOD SODIMM DDR4 4GBPC4-21300 CL19 1B
781994GB DDR4 2666 SO-DIMMMOD SODIMM DDR4 4GBPC4-21300 CL19 1B
802638GB DDR4 2666 SO-DIMMMOD SODIMM DDR4 8GBPC4-21300 CL19 1B
955468GB DDR4-2666 SO-DIMM, ECCMOD SODIMM DDR4 8GBPC4-21300 CL19 1B

Starter Kits

Order No.DescriptionReference
78252Starterkit for COM Express Type 6 modules with Intel 8th or 9th generation Core processors (Coffee Lake H, Coffee Lake Refresh). Consists of the MSC C6-MB-EV Mini-ITX platform board, suitable Heatsink with fan, two memory modules and a suitable power supply with cable kit. Please order separately the COM Express C6B-CFLH or C6B-CFLR module of your choice.MSC C6-SK-CFLH-EV-KIT001

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