MSC C6C-EL
The MSC C6C-EL module is based on Intel‘s multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lake”). Built on 10nm process technology the SoC integrates the next generation Intel Atom processor core architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The module is designed for extended temperature range and 24/7 operation making it an ideal platform for mission critical tasks that require a reliable and performant compute base. It provides significant performance gains over previous Atom generations allowing for technology upgrades within existing power and cooling requirements defined by the system design. Typical applications are industrial IoT, mobile medical equipment, on-board units, way-side controllers and outdoor POS terminals. The MSC C6C-EL can drive up to three independent displays with a maximum of 4k resolution. The COM Express Type 6 interface allows direct access to digital display interfaces including DisplayPort, HDMI and the choice of LVDS versus eDP. With a maximum capacity of 32GB fast DDR4 memory the board satisfies even demanding applications. Optional in-band ECC capabilities allow for protecting code and data kept in memory. High speed IO includes up to eight PCIe Gen 3 lanes and two USB 3.1 interfaces. Mass storage can be supported with the optional on-board eMMC memory and via two SATA channels.
Highlights
- Quad and dual core variants
- Power efficient processors, TDP 6 to 12W
- Extended temperature variants
- Integrated Intel Gen11LP graphics, max. 32 executing units
- Up to 32GB DDR4-3200 SDRAM, dual-channel
- In-band ECC option
- Two SATA 6Gb/s mass storage interfaces
- eMMC mass storage option
- DisplayPort/HDMI interface
- LVDS/Embedded DisplayPort interface
- Three independent displays supported
- DirectX 12, OpenGL 4.5/ES 3.x, OpenCL 1.2 driver support
- Two USB 3.1 and eight USB 2.0 interfaces
- Two UARTs
- Up to eight PCI Express™ lanes
- One Gb Ethernet port
- TSN, TCC support
- UEFI Firmware
- Trusted Platform Module TPM 2.0
Specifications
| Technology | x86 |
| Form Factor | COM Express Compact |
| CPU | Intel Atom® x6425RE Processor, quad-core / 4T, 1.9GHz, 32EU, IBECC, TCC 12W, IUC Intel Atom® x6416RE Processor, quad-core / 4T, 1.7GHz, 16EU, IBECC, TCC, 9W IUC Intel Atom® x6414RE Processor, quad-core / 4T, 1.5GHz, 16EU, IBECC, TCC, 9W IUC Intel Atom® x6214RE Processor, dual-core / 2T, 1.4GHz, 16EU, IBECC, TCC, 6W IUC Intel Atom® x6212RE Processor, dual-core / 2T, 1.2GHz, 16EU, IBECC, TCC, 6W IUC Intel Atom® x6425E Processor, quad-core / 4T, 2.0/3.0GHz, 32EU, IBECC, 12W EUC Intel Atom® x6413E Processor, quad-core / 4T, 1.5/3.0GHz, 16EU, IBECC, 9W EUC Intel Atom® x6211E Processor, dual-core / 2T, 1.3/3.0GHz, 16EU, IBECC, 6W EUC Intel® Pentium® J6426 Processor, quad-core / 4T, 2.0/3.0GHz, 32EUs, 10W, PUC Intel® Pentium® N6415 Processor, quad-core / 4T, 1.2/3.0GHz, 16EU, 6W, PUC Intel® Celeron® J6413 Processor, quad-core / 4T, 1.8/3.0GHz, 16EU, 10W, PUC Intel® Celeron® N6211 Processor, dual-core / 2T, 1.2/3.0GHz, 16EU, 6W, PUC Intel® Technologies: Enhanced Intel® SpeedStep® Technology Intel® Virtualization Technology (VTx-2, VT-d) Intel® Trusted Execution Engine (TXE) Intel® Time Coordinated Computing (TCC) Precision Time Measurement (PTM) Precision Time Measurement (PTP) IUC - Intel Industrial Use Conditions EUC - Intel Embedded Use Conditions PUC - Intel PC Client Use Conditions |
| Chipset | SOC |
| RAM | 2x 204-pin SO-DIMM socket for up to 2x 16 GB (dual channel operation) or 1x 16 GB (single channel operation) DDR4-3200 (max. transfer speed depending on memory type) In-band ECC (on selected variants) |
| Flash | On-board eMMC mass storage option, scalable capacity up to 256GB |
| Storage Interfaces | Up to 2x SATA 6Gb/s |
| USB | 2x USB 3.1 8x USB 2.0 |
| Serial Interfaces | Two UARTS |
| Bus Interfaces | 8x PCI Express Gen 3, up to 6 root ports LPC bus (Low Pin Count bus no DMA support) |
| Display Controller | Integrated Intel graphics Gen11LP Up to 32 execution units (EU) DirectX 12, OpenGL 4.5/ES 3.x, OpenCL 1.2 driver support Media codec support: MPEG2, H.264 (L5.2), VC-1, WMV9, VP8, VP9, JPEG/MPEG, H.265 (HEVC) |
| Display Interfaces | Three independent displays supported: 2x Digital Display Interface (DP 1.2/1.3/1.4 (max. 4096 x 2160 @ 60Hz), HDMI 1.4b/2.0b (max. 4K @ 60Hz) 1x Embedded DisplayPort 1.3 (on variants without LVDS only) max. 4096 x 2160 @ 60Hz, LVDS 24bit, dual-channel (not on all variants) max. 1920 x 1200 @ 60Hz |
| Network Interface | 10/100/1000Base-T (SoC integrated controller) Supports Time-Sensitive Networking (TSN) and Time Coordinated Computing (TCC) |
| Audio Interface | High Definition Audio |
| Security Device | TPM 2.0 |
| Miscellaneous | Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan |
| Feature Highlights | Type 6 pin-out |
| Firmware | AMI Aptio UEFI |
| OS Support | Windows 10 IoT Enterprise RS5 (64bit) Linux (Yocto Project) Kernel 5.4 |
| Power Requirement | Wide range input +8.5 … +20V, 5V Stby optional, 7 W to 14 W (typ.) |
| Environment | Ambient Temperature 0° … 60°C (operating), -25° … 85°C (storage) Extended temp. variants: -40 ... +85°C (operating) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing) |
| Dimensions | 95mm x 95mm |
| Certificates | UL |
| Cooling | Passive heat sink Active heat sink with fan Heat spreader with threaded or non-threaded standoffs |
| Carrier | Small carrier board (Mini-ITX) as part of a starter kit Evaluation board in ATX form factor |
Order Info
| Order No. | Description | Reference | Status |
| 86110 | COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Atom x6425RE, quad-core, 1.9GHz, 12W Graphics: Intel Gen 11LP 32 EUs 2x DP/HDMI LVDS Ethernet: Intel integrated Gbit HD audio 2x SATA, 2x USB3/2, 6x USB2, 8x PCIe Gen 3 TPM 2.0 2x socket for DDR4 SO-DIMM, in-band ECC -40...+85°C (recommended for 24/7 operation) | MSC C6C-EL-X6425RE-NN221I PCBFTX | PV |
| 86122 | COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Atom x6414RE, quad-core, 1.5GHz, 9W Graphics: Intel Gen 11LP 16 EUs 2x DP/HDMI LVDS Ethernet: Intel integrated Gbit HD audio 2x SATA, 2x USB3/2, 6x USB2, 8x PCIe Gen 3 TPM 2.0 2x socket for DDR4 SO-DIMM, in-band ECC -40...+85°C (recommended for 24/7 operation) | MSC C6C-EL-X6414RE-NN221I PCBFTX | PV |
| 86124 | COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Atom x6212RE, dual-core, 1.2GHz, 6W Graphics: Intel Gen 11LP 16 EUs 2x DP/HDMI LVDS Ethernet: Intel integrated Gbit HD audio 2x SATA, 2x USB3/2, 6x USB2, 8x PCIe Gen 3 TPM 2.0 2x socket for DDR4 SO-DIMM, in-band ECC -40...+85°C (recommended for 24/7 operation) | MSC C6C-EL-X6212RE-NN221I PCBFTX | PV |
| 86126 | COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Atom x6425E, quad-core, 2.0GHz, 12W Graphics: Intel Gen 11LP 32 EUs 2x DP/HDMI LVDS Ethernet: Intel integrated Gbit HD audio eMMC 32GB 2x SATA, 2x USB3/2, 6x USB2, 8x PCIe Gen 3 TPM 2.0 2x socket for DDR4 SO-DIMM, in-band ECC -40...+85°C | MSC C6C-EL-X6425E-N5201I PCBFTX | OR |
| 86128 | COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Atom x6413E, quad-core, 1.5GHz, 9W Graphics: Intel Gen 11LP 16 EUs 2x DP/HDMI LVDS Ethernet: Intel integrated Gbit HD audio 2x SATA, 2x USB3/2, 6x USB2, 8x PCIe Gen 3 TPM 2.0 2x socket for DDR4 SO-DIMM, in-band ECC -40...+85°C | MSC C6C-EL-X6413E-NN221I PCBFTX | OR |
| 86130 | COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Atom x6211E, dual-core, 1.3GHz, 6W Graphics: Intel Gen 11LP 16 EUs 2x DP/HDMI LVDS Ethernet: Intel integrated Gbit HD audio 2x SATA, 2x USB3/2, 6x USB2, 8x PCIe Gen 3 TPM 2.0 2x socket for DDR4 SO-DIMM, in-band ECC -40...+85°C | MSC C6C-EL-X6211E-NN221I PCBFTX | OR |
| 86132 | COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Pentium J6426, quad-core, 2.0GHz, 10W Graphics: Intel Gen 11LP 32 EUs 2x DP/HDMI eDP Ethernet: Intel integrated Gbit HD audio 2x SATA, 2x USB3/2, 6x USB2, 8x PCIe Gen 3 TPM 2.0 2x socket for DDR4 SO-DIMM | MSC C6C-EL-J6426-NN121C PCBFTX | OR |
| 86134 | COM Express Type 6 Compact module (95mm x 95mm) CPU: Intel Celeron J6413, quad-core, 1.8GHz, 10W Graphics: Intel Gen 11LP 16 EUs 2x DP/HDMI eDP Ethernet: Intel integrated Gbit HD audio 2x SATA, 2x USB3/2, 6x USB2, 8x PCIe Gen 3 TPM 2.0 2x socket for DDR4 SO-DIMM | MSC C6C-EL-J6413-NN121C PCBFTX | OR |
| 95063 | COM Express Type 6 Compact module (95mm x 95mm)CPU: Intel Pentium J6426, quad-core, 2.0GHz, 10WGraphics: Intel Gen 11LP 32 EUs 2x DP/HDMI LVDSEthernet: Intel integrated Gbit HD audio2x SATA, 2x USB3/2, 6x USB2, 8x PCIe Gen 3 TPM 2.02x socket for DDR4 SO-DIMM | MSCC6C-EL-J6426-NN221CPCBFTX | OR |
| 95041 | COM Express Type 6 Compact module (95mm x 95mm)CPU: Intel Celeron J6413, quad-core, 1.8GHz, 10WGraphics: Intel Gen 11LP 16 EUs 2x DP/HDMI LVDSEthernet: Intel integrated Gbit HD audio2x SATA, 2x USB3/2, 6x USB2, 8x PCIe Gen 3 TPM 2.02x socket for DDR4 SO-DIMM | MSCC6C-EL-J6413-NN221CPCBFTX | OR |
Accessories
Carrier Options
| Order No. | Description | Reference |
| 67295 | COM Express Type 6 Evaluation Carrier Board with PCI Express x4/x16 slot, USB 3.0/2.0, GbE, SATA, DisplayPort, eDP/LVDS, VGA and HD audio interfaces; Mini PCI Express socket, SD card slot, ATX power connector and single 12V power jack. Dimensions 170mm x 170mm (Mini-ITX form factor) | MSC C6-MB-EV-001 PCBFTX |
| 41857 | COM Express Type 6 Evaluation Carrier Board with various PCI Express x1, x4 and x16 slots, USB 3.0/2.0, GbE, SATA, DisplayPort, HDMI, LVDS, eDP, VGA, HD audio interfaces; mSATA and Mini PCI Express sockets, POST code display, ATX power connector. Dimensions 305 x 244 mm (ATX form factor) | MSC C6-MB-EVA PCBFTX |
Cooling Options
| Order No. | Description | Reference |
| 82415 | Passive Heatsink for C6C-EL (Atom versions only), consisting of a single-piece aluminum profile with fins, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC. | MSC C6C-EL-01 HSI-001 |
| 85123 | Heatspreader for C6C-EL (Atom versions only). Single-piece aluminum profile with standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC. | MSC C6C-EL-01 HSP-001 |
| 85930 | Passive Heatsink for C6C-EL (Pentium/Celeron versions only), consisting of a single-piece aluminum profile with fins, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC. | MSC C6C-EL-02 HSI-001 |
| 85124 | Heatspreader for C6C-EL (Atom versions only). Single-piece aluminum profile with threaded standoffs (M2.5), screws and thermopad for the thermal contact to SOC. | MSC C6C-EL-02 HSP-001 |
| 85941 | Heatspreader for C6C-EL (Pentium/Celeron versions only). Single-piece aluminum profile with standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to SOC. | MSC C6C-EL-03 HSP-001 |
| 85942 | Heatspreader for C6C-EL (Pentium/Celeron versions only). Single-piece aluminum profile with threaded standoffs (M2.5), screws and thermopad for the thermal contact to SOC. | MSC C6C-EL-04 HSP-001 |
| 79809 | Fan kit for Heatsink MSC HCA-ALP/RLP-0x HSI-xxx, MSC C6B-ALP/RLP-0x HSI-xxx, MSC C6B-TLH-0x HSI-xxx, MSC C6C-ALP/RLP-0xHSI-xxx, MSC C6C-TLU-0x HSI-xxx, MSC C6C-WLU-0x HSI-xxx, MSCC6C-ALN-0x HSI-xxx, MSC C6C-EL-0x HSI-xxx, MSC C6C-RYZx-0xHSI-xxx, PWM fan 80x80x15mm. | MSC C6C-FANKIT-01-HSF-001 |
Memory Options
| Order No. | Description | Reference |
| 93721 | 4GB DDR4-3200 SO-DIMM, Commercial Temp. | MOD SODIMM DDR4 4GBPC4-25600 CL22 1B |
| 93748 | 4GB DDR4-3200, Sorting Wide Temp. | MOD SODIMM DDR4 4GBPC4-25600 CL22 1B |
| 93750 | 4GB DDR4-3200 SO-DIMM, Commercial Temp. | MOD SODIMM DDR4 4GBPC4-25600 CL22 1B |
| 89531 | 8GB DDR4 3200 SO-DIMM, Sorting Wide Temp. | MOD SODIMM DDR4 8GBPC4-25600 CL22 1B |
| 93718 | 8GB DDR4-3200 SO-DIMM, Wide Temp. | MOD SODIMM DDR4 8GBPC4-25600 CL22 1B |
| 93720 | 8GB DDR4-3200 SO-DIMM, Industrial Temp. | MOD SODIMM DDR4 8GBPC4-25600 CL22 1B |