MSC HCA-RLP
The MSC HCA-RLP COM-HPC Client module features the 13th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. Offering a great scalability of performance, the module is ideal for compute intense applications in automation, instrumentation, high-end medical equipment, transportation, and video surveillance. The Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP). The board is ideal for applications requiring support for extended temperature range and 24/7 continuous operation.
For highest data throughput the module enables fast DDR5-5200 memory technology with up to sixty-four GB SO-DIMM based memory. Module I/O comprises up to eight PCIe Gen 3 lanes, up to eight PCIe Gen 4 lanes and an optional eight lane PEG port capable of PCIe Gen 4. The two Ethernet interfaces provide up to 2.5GbE bandwidth each based on the Intel i226 network controller. Further high-speed I/O can utilize USB ports featuring USB4 and USB 3.2.
System investments are well protected through long-term availability of the module, designed and manufactured by Tria Technologies. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Highlights
- COM-HPC Client module, Size A
- 13th Gen Intel® Core™ processors
- Scalable CPU performance
- Up to fourteen cores, twenty threads
- Industrial grading options (Intel® TCC, TSN, IBECC, ext. Temp., 24/7)
- Up to 64GB DDR5-5200 SDRAM, dual channel
- Intel® Iris® Xe architecture Graphics, up to 96 EUs
- Three DisplayPort/HDMI interfaces
- Embedded DisplayPort interface
- Up to four independent displays
- PCI Express® Gen 3, up to 8 lanes, PCI Express® Gen 4, up to 2×4
- PEG 1×8, PCIe Gen 4/5 (optional)
- Two USB4, two USB 3.2 Gen2, eight USB 2.0 ports
- Two UARTs
- Optional on-board NVMe SSD, up to 1TB
- Optional two SATA 6Gb/s mass storage interfaces
- Two 1 / 2.5 Gb Ethernet ports (Intel® i226)
- Trusted Platform Module TPM 2.0
- Long-term product availability
Specifications
| Technology | x86 |
| Form Factor | COM-HPC Size A |
| CPU | 13th Gen Intel® Core™ processors H-series Intel® Core™ i7-13800HE 6P+8E/20T, 2.5GHz, 96 EUs, 24MB L3, 45/35W cTDP Intel® Core™ i7-13800HRE 6P+8E/20T, 2.5GHz, 96 EUs, 24MB L3, 45/35W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-13600HE 4P+8E/16T, 2.7GHz, 80 EUs, 18MB L3, 45/35W cTDP Intel® Core™ i5-13600HRE 4P+8E/16T, 2.7GHz, 80 EUs, 18MB L3, 45/35W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i3-13300HE 4P+4E/12T, 2.1GHz, 48 EUs, 12MB L3, 45/35W cTDP Intel® Core™ i3-13300HRE 4P+4E/12T, 2.1GHz, 48 EUs, 12MB L3, 45/35W cTDP, TCC/TSN, IBECC, ET P-series Intel® Core™ i7-1370PE 6P+8E/20T, 1.9GHz, 96 EUs, 24MB L3, 28/20W cTDP Intel® Core™ i7-1370PRE 6P+8E/20T, 1.9GHz, 96 EUs, 24MB L3, 28/20W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-1350PE 4P+8E/16T, 1.8GHz, 80 EUs, 12MB L3, 28/20W cTDP Intel® Core™ i5-1350PRE 4P+8E/16T, 1.8GHz, 80 EUs, 12MB L3, 28/20W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-1340PE 4P+8E/16T, 1.8GHz, 80 EUs, 12MB L3, 28/20W cTDP Intel® Core™ i3-1320PE 4P+4E/12T, 1.7GHz, 48 EUs, 12MB L3, 28/20W cTDP Intel® Core™ i3-1320PRE 4P+4E/12T, 1.7GHz, 48 EUs, 12MB L3, 28/20W cTDP, TCC/TSN, IBECC, ET U-series Intel® Core™ i7-1365UE 2P+8E/12T, 1.7GHz, 96 EUs, 12MB L3, 15/12W cTDP Intel® Core™ i7-1365URE 2P+8E/12T, 1.7GHz, 96 EUs, 12MB L3, 15/12W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-1345UE 2P+8E/12T, 1.4GHz, 80 EUs, 12MB L3, 15/12W cTDP Intel® Core™ i5-1345URE 2P+8E/12T, 1.4GHz, 80 EUs, 12MB L3, 15/12W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-1335UE 2P+8E/12T, 1.3GHz, 80 EUs, 12MB L3, 15/12W cTDP Intel® Core™ i3-1315UE 2P+4E/8T, 1.2GHz, 64 EUs, 10MB L3, 15/12W cTDP Intel® Core™ i3-1315URE 2P+4E/8T, 1.2GHz, 64 EUs, 10MB L3, 15/12W cTDP, TCC/TSN, IBECC, ET Intel® Processor U300E 1P+4E/6T, 1.1GHz, 48 EUs, 8MB L3, 15/12W cTDP Note: P core base frequency at nominal TDP shown, other clock frequencies supported |
| Chipset | Integrated into SoC |
| RAM | 2x 262-pin SO-DIMM socket for up to 2x 32GB DDR5 SDRAM (DDR5-5200), dual channel operation minimum capacity 1x 8GB single channel operation |
| Storage Interfaces | 2x SATA channels (up to 6Gb/s), optional optional on-board NVMe, 64GB to 1TB |
| USB | 2x USB4 on COM-HPC USB[0:1]_SSTX/RX 2x USB 3.2 (Gen 1 & 2) on COM-HPC USB[2:3]_SSTX/RX 8x USB 2.0 on COM-HPC USB[0:7] |
| Serial Interfaces | 2x high-speed serial ports |
| Bus Interfaces | PCI Express® Graphics (PEG) 1x8, PCIe Gen 4/5 on COM-HPC PCIe[16:23]¹ PCI Express® Gen 4, up to 2x4 on COM-HPC PCIe[8:15] PCI Express® Gen 3, up to 8 lanes, flexible bifurcation options on COM-HPC PCIe[0:7] ¹ Available on H-series processors |
| Display Controller | Intel® Iris® Xe architecture Graphics, Up to 96 execution units (EU) H.264/AVC, H.265/HEVC, AV1, MJPEG encode/decode/transcode. |
| Display Interfaces | Four independent display streams 3x Digital Display Interface (DP 1.4a, HDMI 2.0b) 1x Embedded DisplayPort 1.4b |
| Network Interface | Two 10/100/1000Base-TX, 2.5G² based on Intel i226, TSN support ² Available bandwidths depending on carrier design I-Temp variants: Intel® i226-IT C-Temp variants: Intel® i226-LM |
| Audio Interface | High Definition Audio |
| Security Device | TPM 2.0 |
| Miscellaneous | Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan |
| Feature Highlights | COM-HPC Client, Size A |
| Firmware | UEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management: ACPI Active fan control USB: USB legacy support (keyboard, mouse, storage) Monitoring: System Monitoring Health Monitoring MSC Adv. Boot Device Selection: Boot device priority setting based on physical interfaces |
| OS Support | Windows 10 IoT Enterprise 2021 LTSC BSP for Linux (Yocto) |
| Power Requirement | Voltage: +8V to +20V, +5V Stby optional, +3V RTC voltage Power Consumption: 23 W to 62 W (typ., variant dependent) |
| Environment | Ambient Temperature: 0° … 60°C (operating) -25° … 85°C (storage) Extended temp. variants: -40 ... +85°C (operating) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing) |
| Dimensions | 120 x 95 |
