XRF Heatsink V2
Target Applications:
- XRF System-On-Modules (SOMs) cooling
Key Features:
- Convenient heat relief solution for office or laboratory environments
- Designed for operation at 25⁰C with forced air convection
- Includes all mounting hardware and thermal gap pads
- Not intended for deployed systems
- CAD files available upon request
Kit Includes:
- XRF Heatsink (AES-XRF-HEATSINK-V2) includes the aluminum heatsink, thermal gap pads and all mounting hardware
- XRF Heatsink Fan (ES-XRF-HEATSINK-V2-FAN) includes only the fan and fan mounting hardware
Passive/Active Cooling Solution for XRF AMD RFSoC System-on-Modules
The XRF Heatsink V2 (AES-XRF-HEATSINK-V2) is designed to meet the thermal relief demands of XRF modules operating in a laboratory environment at 25⁰C with external convection. Airflow through the aluminum fins must be provided externally or by attaching the optional fan assembly (AES-XRF-HEATSINK-V2-FAN). This heatsink assembly can be ordered at avnet.me/xrf-passive-cooling.
Quick-start instructions for assembling XRF heatsinks to the XRF module are included in the XRF Getting Started Guide and further explained in detail in XRF Thermal Considerations – both documents are available by request at RFINFO@avnet.com.
Important Considerations
Careful thermal analysis must be performed before using AES-XRF-HEATSINK-V2 in a deployed product as it was designed strictly to meet the needs of software developers operating the module in a controlled laboratory environment.
XRF products are intended to operate in condensation-free environments only. If subjected to cycling within a thermal chamber, Dry Air Purge or Gaseous Nitrogen (GN2) should be used to minimize condensation. If subjected to cycling outside of a controlled chamber, conformal coating or other measures may be required to avoid damage due to condensation.
Custom XRF Thermal Solutions:
Tria also offers customized cooling solution development for your system. Please contact your Tria sales representative or RFINFO@avnet.com
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