TRIA C6C-QCSX
The COM Express Type 6 module TRIA C6C-RYZ8 is ideal for applications like medical imaging, gaming platforms, AI enhanced solutions in the edge and security appliances. With the on-chip XDNA Neural Processing Unit, it is the right fit for enabling AI applications, that run on the local system independently from a cloud-based approach. Applications also gain outstanding compute performance from up to eight CPU cores and six RDNA3 work group processors integrated into the AMD RyzenTM Embedded 8000 Series Processor.
The module provides up to four independent display pipes with high-resolution, highest-level graphics and video en-/ decoding acceleration. The Type 6 pin-out allows direct access to high bandwidth display output from interfaces like eDP, LVDS, DisplayPort, and HDMI. Further high-bandwidth interfaces include USB 3.2/2.0, PCIe Gen 3/4, and 1/2.5Gb Ethernet.
The module with space-saving COM Express Compact formfactor can be equipped with up to 128GB of fast DDR5 SO-DIMM memory. The TRIA C6C-RYZ8 offers hardware based security compliant to the requirements of TCG (Trusted Computing Group) and features TPM 2.0 capability.
Highlights
- Qualcomm Snapdragon® X Elite processor
- Scalable CPU performance, up to twelve cores
- Powerful Qualcomm® Adreno™ GPU
- Qualcomm® Hexagon™ NPU with 45 TOPS of AI performance
- LPDDR5X main memory, memory-down, up to 64GB
- Three DisplayPort interfaces
- LVDS / Embedded DisplayPort interface
- PCI Express® Gen 4, up to 1x8 + 1x4/2x2
- PCI Express® Gen 3, 2x1 + 1x2/1x1
- Up to two USB4, four USB 3.2 Gen1/2 and eight USB 2.0 ports
- Two UARTs
- Up to 1TB on-board UFS Flash
- 1 / 2.5 Gb Ethernet port, TSN support
- Trusted Platform Module TPM 2.0
- COM Express Type 6, Compact
- Long-term product availability
Specifications
| Technology | Arm |
| Form Factor | COM Express Compact Type 6 |
| CPU | Qualcomm Snapdragon® X Elite X1E-84-100, 12C, 4.2GHz X1E-80-100, 12C, 4.0GHz X1E-78-100, 12C, 3.4GHz Qualcomm Snapdragon® X Plus X1P-66-100, 10C, 4.0GHz X1P-64-100, 10C, 3.4GHz X1P-46-100, 8C, 4.0GHz X1P-42-100, 8C, 3.4GHz Qualcomm Snapdragon® X X1-26-100, 8C, 2.7GHz |
| Chipset | Integrated into SoC |
| RAM | LPDDR5X memory, memory-down Capacity options: 8GB, 16GB, 32GB, 64GBB |
| Flash | Up to 1TB UFS, soldered (optional) |
| Storage Interfaces | UFS (onboard) NVME at PCI Express (carrier design dependent) |
| USB | Up to 2x USB4 Gen 2, mutually exclusive with DDI 1, 2 4x USB 3.2 (Gen 1 & 2) 8x USB 2.0 Note: capabilities depending on carrier design |
| Serial Interfaces | 2x UART |
| Bus Interfaces | PCI Express® Gen 4, up to 1x8/(1x4) ¹ + 1x4/2x2 PCI Express® Gen 3, 2x1 + 1x2/1x1 ¹ SKU dependent |
| Display Controller | Adrenoâ„¢ GPU, up to 1.5GHz |
| Display Interfaces | Up to 3x Digital Display Interface (DP 1.4b), DDI 1, 2 mutually exclusive with USB4 Up to two USB4/USB-C ports (DP tunneling) 1x Embedded DisplayPort 1.4b, mutually exclusive with LVDS 1x LVDS 24bit, dual-channel, mutually exclusive with eDP |
| Network Interface | 10/100/1000Base-TX, 2.5G² based on Qualcomm QPS615, with TSN support ² Available bandwidths depending on carrier design |
| Audio Interface | SoundWire |
| Security Device | TPM 2.0 |
| Miscellaneous | Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan |
| Firmware | UEFI boot |
| OS Support | Windows 11 IoT Yocto Linux Ubuntu Linux (on request) Android (on request) |
| Power Requirement | Voltage: +8.5V to +18V, +5V Stby optional Power Consumption: tbd |
| Environment | Ambient Temperature: 0° … 60°C (operating) -25° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing) |
| Dimensions | 95mm x 95mm |
| Certificates | UL / CE |
Order Info
| Order No. | Description | Reference | Status |
| tbd | Contact Tria for ordering information | MSC C6C-QCSX-xxxxx | OR |
Accessories
Carrier Options
| Order No. | Description | Reference |
| 111650 | COM Express Type 6 Evaluation Carrier Board with various PCI Express x1, x4 and x16 slots, USB 3.0/2.0, GbE, M.2, SD card socket, SATA, DisplayPort, LVDS, eDP, VGA, HD audio interfaces; ATX power connector. Dimensions 305 x 244 mm (ATX form factor) | MSC C6-MB-EV4 PCBFTX |
Cooling Options
| Order No. | Description | Reference |
| tbd | Contact Tria for ordering information | MSC C6C-QCSX-Hxxxx |
