TRIA HMM-QCSX
The TRIA HMM-QCSX COM-HPC Mini module is based on the Qualcomm Snapdragon® X Elite processor. This highly energy-efficient processor offers best-in-class performance per watt, making it the ideal platform for applications that require outstanding performance with low power consumption and minimal cooling measures. It combines the Qualcomm Oryon™ CPU with up to twelve cores, the Adreno™ GPU driving excellent graphics throughput, and the Hexagon™ NPU accelerating AI applications with up to 45 TOPS.
With its small formfactor and rich IO interfaces, the module is best suited for automation, robotics, autonomous vehicles, medical devices and other system installations that require the highest performance in the smallest space. Up to sixty-four GB main memory based on fast LPDDR5X technology, sixteen PCI Express lanes, multiple graphics outputs, USB ports and two network interfaces give system architects a lot of design flexibility.
System investments are well protected through long-term availability of the module, designed and manufactured by Tria Technologies. In addition, the COM-HPC Mini standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Highlights
- Qualcomm Snapdragon® X Elite processor
- Scalable CPU performance, up to twelve cores
- Powerful Qualcomm® Adreno™ GPU
- Qualcomm® Hexagon™ NPU with 45 TOPS of AI performance
- LPDDR5X main memory, memory-down, up to 64GB
- Embedded DisplayPort interface
- Up to two DisplayPort interfaces (DDI or USB4)
- PCI Express® Gen 4, up to 1x8 + 1x4/2x2
- PCI Express® Gen 3, 2x1 + 1x2/1x1
- Up to two USB4, four USB 3.2 Gen1/2 and eight USB 2.0 ports
- Two UARTs
- Up to 1TB on-board UFS Flash
- Two 1 / 2.5 Gb Ethernet port, TSN support
- Trusted Platform Module TPM 2.0
- Space saving COM-HPC Mini
- Long-term product availability
Specifications
Technology | Arm |
Form Factor | COM-HPC Mini |
CPU | Qualcomm Snapdragon® X Elite X1E-84-100, 12C, 4.2GHz X1E-80-100, 12C, 4.0GHz X1E-78-100, 12C, 3.4GHz Qualcomm Snapdragon® X Plus X1P-66-100, 10C, 4.0GHz X1P-64-100, 10C, 3.4GHz X1P-46-100, 8C, 4.0GHz X1P-42-100, 8C, 3.4GHz Qualcomm Snapdragon® X X1-26-100, 8C, 2.7GHz |
Chipset | Integrated into SoC |
RAM | LPDDR5X memory, memory-down Capacity options: 8GB, 16GB, 32GB, 64GBB |
Flash | Up to 1TB UFS, soldered (optional) |
Storage Interfaces | UFS (onboard) NVME at PCI Express (carrier design dependent) |
USB | Up to two USB4 on COM-HPC SS Lane 2, 3 (mutually exclusive with DD1) and Lane 4, 5 (mutually exclusive with USB3 #2, #3) Two USB 3.2 Gen 2x1 on COM-HPC SS Lane 6, 7 (USB3 #0, #1) Up to two USB 3.2 Gen 2x1 on COM-HPC SS Lane 4, 5 (mutually exclusive with USB4 #1 8x USB 2.0 on COM-HPC USB[0:7] Note: supported interfaces depending on COM-HPC carrier design. Config 3 on request |
Serial Interfaces | 2x UART |
Bus Interfaces | PCI Express® Gen 4, up to 1x8/(1x4) ¹ + 1x4/2x2 PCI Express® Gen 3, 2x1 + 1x2/1x1 ¹ SKU dependent |
Display Controller | Adreno™ GPU, up to 1.5GHz |
Display Interfaces | Supports COM-HPC Mini Config 1, 2 Up to two DisplayPort interfaces (DDI), DP 1.4b, Config 1 Up to two USB4/USB-C ports (DP tunneling), 1x USB4 with Config 2 1x Embedded DisplayPort 1.4b Note: supported interfaces depending on COM-HPC carrier design. Config 3 on request |
Network Interface | 2x 10/100/1000Base-TX, 2.5G² based on Qualcomm QPS615, with TSN support ² Available bandwidths depending on carrier design |
Audio Interface | SoundWire |
Security Device | TPM 2.0 |
Miscellaneous | Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan |
Firmware | UEFI boot |
OS Support | Windows 11 IoT Yocto Linux Ubuntu Linux (on request) Android (on request) |
Power Requirement | Voltage: +8.5V to +18V, +5V Stby optional Power Consumption: tbd |
Environment | Ambient Temperature: 0° … 60°C (operating) -25° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing) |
Dimensions | 95mm x 70mm |
Certificates | UL / CE |
Order Info
Order No. | Description | Reference | Status |
tbd | Contact Tria for ordering information | MSC HMM-QCSXxxxxx | OR |
Accessories
Carrier Options
Order No. | Description | Reference |
tbd | COM-HPC Mini Carrier Board | MSC HM-MB-EV BRDFTX |
Cooling Options
Order No. | Description | Reference |
tbd | Contact Tria for ordering information | MSC HMM-QCSX-Hxxxx |
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