TRIA HMM-QCSX

The TRIA HMM-QCSX COM-HPC Mini module is based on the Qualcomm Snapdragon® X Elite processor. This highly energy-efficient processor offers best-in-class performance per watt, making it the ideal platform for applications that require outstanding performance with low power consumption and minimal cooling measures. It combines the Qualcomm Oryon™ CPU with up to twelve cores, the Adreno™ GPU driving excellent graphics throughput, and the Hexagon™ NPU accelerating AI applications with up to 45 TOPS.

With its small formfactor and rich IO interfaces, the module is best suited for automation, robotics, autonomous vehicles, medical devices and other system installations that require the highest performance in the smallest space. Up to sixty-four GB main memory based on fast LPDDR5X technology, sixteen PCI Express lanes, multiple graphics outputs, USB ports and two network interfaces give system architects a lot of design flexibility.

System investments are well protected through long-term availability of the module, designed and manufactured by Tria Technologies. In addition, the COM-HPC Mini standard enables performance scaling and migrating applications to future technology upgrades when they become available.

Highlights

  • Qualcomm Snapdragon® X Elite processor
  • Scalable CPU performance, up to twelve cores
  • Powerful Qualcomm® Adreno™ GPU
  • Qualcomm® Hexagon™ NPU with 45 TOPS of AI performance
  • LPDDR5X main memory, memory-down, up to 64GB
  • Embedded DisplayPort interface
  • Up to two DisplayPort interfaces (DDI or USB4)
  • PCI Express® Gen 4, up to 1x8 + 1x4/2x2
  • PCI Express® Gen 3, 2x1 + 1x2/1x1
  • Up to two USB4, four USB 3.2 Gen1/2 and eight USB 2.0 ports
  • Two UARTs
  • Up to 1TB on-board UFS Flash
  • Two 1 / 2.5 Gb Ethernet port, TSN support
  • Trusted Platform Module TPM 2.0
  • Space saving COM-HPC Mini
  • Long-term product availability

Specifications

TechnologyArm
Form FactorCOM-HPC Mini
CPUQualcomm Snapdragon® X Elite
X1E-84-100, 12C, 4.2GHz
X1E-80-100, 12C, 4.0GHz
X1E-78-100, 12C, 3.4GHz
Qualcomm Snapdragon® X Plus
X1P-66-100, 10C, 4.0GHz
X1P-64-100, 10C, 3.4GHz
X1P-46-100, 8C, 4.0GHz
X1P-42-100, 8C, 3.4GHz
Qualcomm Snapdragon® X
X1-26-100, 8C, 2.7GHz
ChipsetIntegrated into SoC
RAMLPDDR5X memory, memory-down
Capacity options: 8GB, 16GB, 32GB, 64GBB
FlashUp to 1TB UFS, soldered (optional)
Storage InterfacesUFS (onboard)
NVME at PCI Express (carrier design dependent)
USBUp to two USB4 on COM-HPC SS Lane 2, 3 (mutually exclusive with DD1) and Lane 4, 5 (mutually
exclusive with USB3 #2, #3)
Two USB 3.2 Gen 2x1 on COM-HPC SS Lane 6, 7 (USB3 #0, #1)
Up to two USB 3.2 Gen 2x1 on COM-HPC SS Lane 4, 5 (mutually exclusive with USB4 #1
8x USB 2.0 on COM-HPC USB[0:7]
Note: supported interfaces depending on COM-HPC carrier design. Config 3 on request
Serial Interfaces2x UART
Bus InterfacesPCI Express® Gen 4, up to 1x8/(1x4) ¹ + 1x4/2x2
PCI Express® Gen 3, 2x1 + 1x2/1x1
¹ SKU dependent
Display ControllerAdreno™ GPU, up to 1.5GHz
Display InterfacesSupports COM-HPC Mini Config 1, 2
Up to two DisplayPort interfaces (DDI), DP 1.4b, Config 1
Up to two USB4/USB-C ports (DP tunneling), 1x USB4 with Config 2
1x Embedded DisplayPort 1.4b
Note: supported interfaces depending on COM-HPC carrier design. Config 3 on request
Network Interface2x 10/100/1000Base-TX, 2.5G² based on Qualcomm QPS615, with TSN support
² Available bandwidths depending on carrier design
Audio InterfaceSoundWire
Security DeviceTPM 2.0
MiscellaneousWatchdog Timer:
Initiates system reset, programmable
Fan Supply:
4-pin header for CPU fan, PWM speed controlled
and PWM speed control for system fan supported
RTC battery:
external
System Monitoring:
voltage, temperature, CPU fan, system fan
FirmwareUEFI boot
OS SupportWindows 11 IoT
Yocto Linux
Ubuntu Linux (on request)
Android (on request)
Power RequirementVoltage:
+8.5V to +18V, +5V Stby optional
Power Consumption:
tbd
EnvironmentAmbient Temperature:
0° … 60°C (operating)
-25° … 85°C (storage)
Humidity:
5 … 95% (operating, non-condensing),
5 … 95% (storage, non-condensing)
Dimensions95mm x 70mm
CertificatesUL / CE

Order Info

Order No.DescriptionReferenceStatus
tbdContact Tria for ordering informationMSC HMM-QCSXxxxxxOR

Accessories

Carrier Options

Order No.DescriptionReference
tbdCOM-HPC Mini Carrier BoardMSC HM-MB-EV BRDFTX

Cooling Options

Order No.DescriptionReference
tbdContact Tria for ordering informationMSC HMM-QCSX-Hxxxx

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Download Datasheet

Click the link below to download TRIA HMM-QCSX datasheet.