Application Optimized SOMs
Proprietary Form Factor
Tria designs and manufactures a broad range of proprietary form factor solutions. Designed to optimize the core architecture for power, performance, size, I/O, and to leverage existing 3rd party ecosystems, these solutions provide customer flexibility and ease of implementation. We’ve been providing application optimized solutions since 2013 that are used by thousands of customers across a wide range of markets and applications.
Tria provides a broad range of solutions spanning the complete AMD SoC portfolio. Whether you’re looking for a cost optimized module that contains the common functions and interfaces required to support the core of most SoC designs, a highly flexible rugged SOM based on the AMD UltraScale+ MPSoC, or a high-end RFSoC solution designed for integration into deployed RF systems demanding small footprint, low power, and real-time processing.
MicroZed
MicroZed™ is a low-cost SOM that is based on the AMD Xilinx Zynq®-7000 SoC. In addition to the Zynq-7000 SoC, the module contains the common functions and interfaces required to support the core of most SoC designs, including memory, configuration, Ethernet, USB, and clocks.
Industrial Temperature MicroZed SOMs are built with components supporting extended temperatures of -40 to +85°C, with the exception of the use of the microSD card connector.
PicoZed
PicoZed™ is a highly flexible, rugged, System-On-Module, or SOM that is based on the AMD Xilinx Zynq®-7000 All Programmable SoC. It offers designers the flexibility to migrate between the 7010, 7015, 7020, and 7030 Zynq-7000. All Programmable SoC devices in a pin-compatible footprint.
The PicoZed module contains the common functions required to support the core of most SoC designs, including memory, configuration, Ethernet, USB, and clocks.
UltraZed-EG
UltraZed-EG™ SOM is a highly flexible, rugged, System-On-Module (SOM) based on the AMD Xilinx Zynq® UltraScale+™ MPSoC. Designed in a small form factor, the UltraZed-EG SOM packages all the necessary functions such as system memory, Ethernet, USB, and configuration memory needed for an embedded processing system.
Designers can simply design their own carrier card, plug-in UltraZed-EG SOM, and start their application development with a proven Zynq UltraScale+ MPSoC sub-system.
UltraZed-EV
UltraZed-EV™ SOM is a high performance, full-featured, System-On-Module (SOM) based on the AMD Xilinx Zynq® UltraScale+™ MPSoC EV family of devices. Designed in a small form factor, the UltraZed-EV SOM on-board dual system memory, high-speed transceivers, Ethernet, USB, and configuration memory provides an ideal platform for embedded video processing systems.
Designers can simply design their own carrier card, plug-in UltraZed-EV SOM, and start their application development with a proven Zynq UltraScale+MPSoC sub-system.
VE2302
The VE2302 SOM provides the flexibility and versatility for developers to enable designs with the AMD Versal™ AI Edge series. This System-On-Module (SOM) is a small form factor and full-featured board based on the Versal AI Edge VE2302 device featuring 328K programmable logic cells with a Dual-core Arm® Cortex®-A72 MPCore™ and Dual-core Arm Cortex-R5F MPCore, as well as L1 and L2 cache and 256KB on-chip memory all with ECC.
Whether you want to use bare metal, Linux, or Vits AI Accelerators, using a Vivado-enabled board definition file and PetaLinux BSP will enable you to be up and running in no time!
XRF
Avnet XRF™ RFSoC System-on-Modules are designed for integration into deployed RF systems demanding small footprint, low power, and real-time processing. XRF modules feature the AMD Xilinx Zynq®️ UltraScale+™ RFSoC with up to 16 RF-ADC and 16 RF-DAC channels and up to 6GHz analog bandwidth.
Combine a production-ready XRF module with an XRF Carrier Card and Avalon™ software suite to jumpstart proof-of-concept and application development. Then deploy your system with the same XRF module used for proof-of-concept. Example code and tutorials demonstrate AMD Xilinx RFSoC multi-tile sync (multi-converter sync) and multi-board synchronized analog capture.
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AAG Compute
XRF16 Xilinx RFSoC Gen3 System-On-Module
Read moreProduction-ready 16×16 direct-RF sampling module with 6 GHz analog bandwidth.
The Tria XRF16™ RFSoC System-on-Module is designed for integration into…
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AAG Compute
XRF8 Xilinx RFSoC Gen3 System-On-Module
Read moreProduction-ready 8×8 direct-RF sampling module with 6 GHz analog bandwidth.
The Tria XRF8™ RFSoC System-on-Module is designed for integration into …
Development Kits
VE2302 Development Kit
The VE2302 Development Kit (DK)is specifically designed to evaluate Avnet’s VE2302 System-on-Module (SOM) and AI Edge IO Carrier Card. With a VE2302 DK a designer can assess the capabilities of the AMD Versal™ AI Edge Adaptive SoC with a combination of versatile peripherals. This combination helps designers to kick-start product development giving access to the feature set of the Versal AI Edge Adaptive SoC.
The VE2302-DK is a combination of a VE2302 SOM, AI Edge IO Carrier Card, and a power supply with an Out-of-Box reference design, downloadable Hardware User Guide, Board Definition File (BDF), and Board-Support-Package (BSP) along with example designs to help developers get started in the development of custom applications.
Azure Sphere MT3620 Module
The Avnet Azure Sphere MT3620 Module supports Microsoft’s Azure Sphere end-to-end solution for highly secured, Wi-Fi-connected microcontroller (MCU) devices. The production-ready, certified module supports an on-board chip antenna for cost-optimized systems.
By integrating all the necessary support and RF front-end circuitry onto the small 33 mm x 22 mm module, Avnet has reduced the design time for implementing Sphere-based solutions. More importantly, developers can leverage the module’s wireless certifications for their end product, saving considerable certification cost and testing time.
Development Kit
Microsoft Azure Sphere Starter Kit V2
Azure Sphere MT3620 Starter Kit 2.0 prototyping platform features Avnet’s globally certified Azure Sphere module (based on MT3620AN device). The Starter Kit board features multiple expansion interfaces, including two MikroE Click sockets, an I2C Grove connector, and an OLED display connector, to enable easy hardware customization with a wide range of sensors and interfaces via the addition of custom or off-the-shelf plug-in boards. The Azure Sphere MT3620 device allows developers to create highly secure devices without the need to implement any security features.
8ULP SOM
The 8ULP SOM is a compact (43mm x 36mm), ultra-low power, peripheral-rich, compute module, designed for integration onto custom OEM hardware. The NXP i.MX 8ULP device on this SOM is architected for optimal power efficiency, with separated processing domains.
The compact SOM dimensions, energy-efficient multi-processor architecture, EdgeLock security, graphic capabilities and rich peripheral mix, all add-up to a versatile intelligent edge solution.
Development Kit
MaaXBoard 8ULP
MaaXBoard 8ULP features the NXP i.MX 8ULP processor to achieve ultra-low power, EdgeLock® secured intelligent edge applications
The i.MX 8ULP SoC device is architected with separate processing domains
- The application domain includes two Arm® Cortex®-A35 (1 GHz) cores plus 3D/2D GPUs for GUI-enabled Linux applications.
- The Real Time domain includes an Arm Cortex-M33 (216 MHz) core, plus Fusion DSP (200 MHz) core for low-power audio/voice use cases.
- The LPAV domain (Low Power Audio Video) has a HiFi 4 DSP (600 MHz) core to support advanced audio, ML and sensor applications.
- The S400 Security Enclave and Power Manager also utilize RISC-V cores.
RASynBoard
RASynBoard is a low-cost evaluation kit that includes the RASynBoard core module with an I/O board for prototyping and development.
RASynBoard module (25mm x 30mm) is a tiny, ultra-low power, edge AI/ML board, based on a Syntiant NDP120 Neural Decision Processor, a Renesas RA6M4 host MCU plus a power-efficient DA16600 Wi-Fi/BT combo module. The NDP120 subsystem with onboard digital microphone, IMU motion sensor and SPI Flash memory, achieves highly efficient processing of acoustic- and motion events. Battery and USB-C device connectors facilitate stand-alone use, while a compact under-board connector enables integration with custom OEM boards and additional sensors.