Development kits

AMD

AUBoard 15P

The AUBoard 15P provides the flexibility and versatility for engineers to experiment with and learn the AMD Artix UltraScale+ ™ architecture. The feature rich AU15P device features 170K programmable logic cells and 12 GTH multi-gigabit transceivers as well as 576 DSP slices and 7.6 Mb of on-chip RAM. Whether you want to explore bare metal, RTOS, or Linux software, the AUBoard 15P will give you a solid base foundation to experiment.

K24 Development Kit

The K24 Development Kit is a combination of an AMD KRIA K24 system on module (reduced feature) and an Avnet Embedded K24 IO Carrier Card with an Out-of-Box reference design, downloadable Hardware User Guide, Board Definition File (BDF), and Board-Support-Package (BSP) for engineers to design with the K24 SOM.

VE2302 Development Kit

The VE2302 Development Kit (DK)is specifically designed to evaluate Avnet’s VE2302 System-on-Module (SOM) and AI Edge IO Carrier Card. With a VE2302 DK a designer can assess the capabilities of the AMD Versal™ AI Edge Adaptive SoC with a combination of versatile peripherals. This combination helps designers to kick-start product development giving access to the feature set of the Versal AI Edge Adaptive SoC.

The VE2302-DK is a combination of a VE2302 SOM, AI Edge IO Carrier Card, and a power supply with an Out-of-Box reference design, downloadable Hardware User Guide, Board Definition File (BDF), and Board-Support-Package (BSP) along with example designs to help developers get started in the development of custom applications.

AMD RFSoC Gen3 Kit for mmWave

The Avnet Wideband mmWave Radio Development Platform for RFSoC Gen-3 is ideal for prototyping RF applications in mmW bands including 5G NR FR2, wireless backhaul, as well as K/Ka band radar and SATCOM. This platform combines the Otava DTRX2 Dual Transceiver mmWave Radio Card – jointly developed by Otava and Avnet – with the AMD Xilinx Zynq® UltraScale+ ™ RFSoC ZCU208 Evaluation Kit.

Explore the entire signal chain from millimeter wave RF in the 19 to 31 GHz range to IF sampling in RFSoC Gen-3 data converters reaching 6 GHz. Native connection to MATLAB® and Simulink® is provided by Avnet’s RFSoC Explorer®, featuring graphical control of the platform and intuitive APIs for programmatic access.

5G mmWave Development Platform

Avnet and Fujikura have created a highly integrated 5G FR2 phased array antenna development platform for mmWave frequency bands. Through real-time control of digital and RF settings using Avnet’s RFSoC Explorer® software, developers can create and prototype wireless applications with AMD’s Zynq® UltraScale+™ RFSoC Gen3 and Fujikura’s FutureAcess™ Phased Array Antenna Module (PAAM). Seamless expansion to multiple PAAMs enables advanced beamforming scenarios and sub-array topologies.

Microsoft

Microsoft Azure Sphere Starter Kit V2

Azure Sphere MT3620 Starter Kit 2.0 prototyping platform features Avnet’s globally certified Azure Sphere module (based on MT3620AN device). The Starter Kit board features multiple expansion interfaces, including two MikroE Click sockets, an I2C Grove connector, and an OLED display connector, to enable easy hardware customization with a wide range of sensors and interfaces via the addition of custom or off-the-shelf plug-in boards. The Azure Sphere MT3620 device allows developers to create highly secure devices without the need to implement any security features.

NXP

Avnet i.MX 8M Plus Edge AI Kit

The Avnet i.MX 8M Plus Edge AI Kit consists of a SMARC System-on-Module(SOM) and an Industrial Carrier board bundled together with a dual camera adapter. The high-performance NPU of the i.MX 8M Plus processor allows machine learning and Artificial Intelligence implementations with heavy compute demands to be pushed from the cloud down to the edge.;

When combining this development kit with the NXP eIQ™ Machine Learning Software Development Environment, many options for Inference Engines, Vision Libraries, and ML workflow can be used to quickly deploy applications.

MaaXBoard 8ULP

MaaXBoard 8ULP features the NXP i.MX 8ULP processor to achieve ultra-low power, EdgeLock® secured intelligent edge applications. The i.MX 8ULP SoC device is architected with separate processing domains:

The application domain includes two Arm® Cortex®-A35 (1 GHz) cores plus 3D/2D GPUs for GUI-enabled Linux applications.
The Real Time domain includes an Arm Cortex-M33 (216 MHz) core, plus Fusion DSP (200 MHz) core for low-power audio/voice use cases.
The LPAV domain (Low Power Audio Video) has a HiFi 4 DSP (600 MHz) core to support advanced audio, ML and sensor applications.
The S400 Security Enclave and Power Manager also utilize RISC-V cores.

MaaXBoard 8ULP is engineered as two PCBs, a small SOM (43mm x 36mm) connected via 2×100-pin connectors to a baseboard (BB) in compact Raspberry Pi form-factor, which supports a versatile set of I/O interfaces.

Qualcomm

QCS6490 Vision-AI Development Kit

The QCS6490 Vision-AI Development Kit features an energy-efficient, multi-camera, SMARC 2.1.1 compute module, based on the Qualcomm QCS6490 SOC device.

High performance cores on the QCS6490 SOC include an 8-core Kryo™ 670 CPU, Adreno 643 GPU, Hexagon DSP and 6th gen AI Engine (13 TOPS), Spectra 570L ISP (64MP/30fps capability) and Adreno 633 VPU (4K30/4K60 enc/dec rates), ensure that exceptional concurrent video I/O processing performance is delivered.

The development kit ships with a Yocto-based Linux BSP, plus example AI and multi-camera open-source applications. Additional OS options are available, with Windows 11 IoT Enterprise due in 2H24.

Renesas

RASynBoard Kit

RASynBoard is a low-cost evaluation kit that includes the RASynBoard core module with an I/O board for prototyping and development.

RASynBoard module (25mm x 30mm) is a tiny, ultra-low power, edge AI/ML board, based on a Syntiant NDP120 Neural Decision Processor, a Renesas RA6M4 host MCU plus a power-efficient DA16600 Wi-Fi/BT combo module. The NDP120 subsystem with onboard digital microphone, IMU motion sensor and SPI Flash memory, achieves highly efficient processing of acoustic- and motion events. Battery and USB-C device connectors facilitate stand-alone use, while a compact under-board connector enables integration with custom OEM boards and additional sensors.

RASynBoard IO board (50mm x 30mm) is included for implementation of a compact two board evaluation kit assembly. This pins-out a subset of the NDP120 and RA6M4 I/Os to popular Pmod, Click header and expansion header footprints, enabling connection with additional external microphones and sensor options. An onboard debugger MCU (SWD and UART interfaces), button switches, RGB LED and removable MicroSD storage, further maximize prototyping versatility and utility.