HVAC
The demand for energy-efficient, secure, and intelligent environments is rising, driving manufacturers to adopt advanced IoT solutions.
From heat pumps and smart thermostats to sophisticated air conditioning systems, modern HVAC technologies increasingly feature low-level MPUs, advanced touchscreen displays, high speed connectivity, AI integration and more.
These advancements provide superior user experiences and drive energy efficiency. However, manufacturers face challenges in transitioning to MPUs, developing custom displays and compute, whilst also ensuring scalability and long-term durability.
Companies that navigate these challenges and deliver innovative, cost-effective HVAC solutions will lead this dynamic market.
Application - HVAC
At Tria, we revolutionize building security and automation with advanced IoT solutions. From smart thermostats and security cameras to fire safety equipment and automated lighting, our technologies transform facilities into efficient, secure, and intelligent environments. By embedding intelligence into everyday objects, we drive business value and energy efficiency, swiftly bringing innovative solutions to market and making visionary concepts a reality.
General Requirements for HVAC
- User Interface for Status / Service information (Usage a few times per year)
- Competitive price is important
- Long term reliability (15-20 Years in usage after installation in the building)
- Longevity > 10 Years
- Typical Quantities 50K-300K / Years
- Trend from MCU to low level MPU (IoT Connectivity, larger Displays,…)
- More advanced User Interface (Typical 5-7” Display)
- Front design important
- Integration needs to be aligned with customer standard design
CPU Building Blocks - HVAC
Typical CPU Platforms for applications at HVAC
MSC OSM-MF-IMX8PLUS
- Dual/Quad core Arm Cortex-A53
- Multimedia 2D/3D GPU / NPU (2.3 TOPS)
- MIPI-DSI x4, PCI Express Gen. 3
- 1x USB 2.0, 1x USB3.0, 2x GbE, 2x CAN-FD
MSC OSM-MF-IMX8MINI
- Solo/Dual/Quad core Arm Cortex-A53
- Multimedia 2D/3D GPU (VPU Mini only)
- MIPI-DSI x4, PCI Express Gen. 2 (Mini only)
- 2x USB 2.0, GBE
MSC C6C-RLP (13th Gen Intel® Core™ CPU)
- Intel® Core™ 13th gen Processor
- Up to 4C+8C, 32GB LPDDR5-6400
- IB-ECC, PCIe 8x, TSN/TCC
- I-Temp, industrial UC
MSC OSM-SF-IMX93
- Single / Dual core Arm Cortex-A55 CPU
- MIPI-DSI x4 / LVDS (optional on RGB)
- 2x Gigabit Ethernet (RGMII)
- 2x SPI, 4x I²C, 4x UART, 20 GPIOs, 2x ADC inputs, 2x CAN-FD
A complete Computer-on-Module can be treated as a functional macro and inserted into a full-custom board design for the application.
That will shorten the development time of customer specific board designs dramatically, help to achieve the shortest possible time-to-market because the functional macro is already proven to work, and comes with full software and firmware support.
CUSTOM BOARD and SOFTWARE SOLUTIONS for HVAC
- Carrier board
- Custom ARM SBC
- Custom BSP / BIOS
- OS and Application SW Support
Standard Compute Module
Standard Compute Module on Baseboard / Carrierboard
Compute module technology into full-custom compute design
HVAC - Typical HW Concept
Typical Block Diagram
“HMI for heat pumps”
Display Innovation for HVAC applications
Avnet’s Ecosystem consists of all major tier 1 display manufacturers
Displays go custom – Most AvE projects require Full Stack, i.e. Display, Touch & application specific Cover Lens (Glass) bonded together.
With our engineering / R&D in Germany and cooperation with all major touch & touch driver partners and 2nd tier display integrators we deliver the best solution for your application.
Standardized display touch platforms like SimpleFlex allows fast time to market
Typical Display – Touch Requirements
For HVAC Application
Display Size: 5“ – 7“ depending on UI and function
Display Type: TFT Display / Ultra Low Power
Brightness: Brightness of 300 – 500 cd/m² for indoor use
Touch: PCAP low cost / PCAP button
Bonding: Typical air gap bonding
Temp. (op): Extended temperature range of -20 to + 70°C
Longevity: 5-7 Years (Second Source for cell is crucial)
Custom HMI for heat pumps
Customers’ Requirements
- Push usability of heat pumps ahead of competition
- Enhance energy efficiency by intelligent control
- Unify user experience over different product series
Our Solution
- ARM based single board computer (SBC)
- 5” TFT with capacitive touch
- Tooling based plastic housing retrofit into heat pumps
- 15 Year longevity
The Result
- Reduce energy cost of end customer by intelligent control
- Increase market share of our customer simplifying usability
- Flexibility in delivery in demanding market due to own board and system manufacturing
