MSC HS-MB-EV
The MSC HS-MB-EV is intended for design teams that require an easy and fast enablement of COM-HPC® based solutions for lab evaluation, rapid prototyping, and application development. Engineers can use it as a reference design for developing their own COM-HPC platform. The COM-HPC carrier provides a COM-HPC Server interface with a rich set of I/O routed to the module socket including high-speed PCIe, multiple Ethernet ports, USB and SATA. COM-HPC Server modules of either Size D or E can be installed on the carrier. Combined with a COM-HPC Server module such as the versatile MSC HSD-ILDL, many of the CPUs high-speed I/O signals are available on break-out connectors located on the face plate and on-board, including 25G / 10G Ethernet ports and PCIe sockets.
Highlights
- COM-HPC® Server Carrier
- Socket for COM-HPC® Server module with size D or E
- One PCI Express x16 slots
- Two PCI Express x8 slots
- Two PCI Express x4 slots
- Two M.2 slots with PCIe x4
- All PCIe slots support up to Gen 4
- Four SFP28 card cages for up to 25G Ethernet per port
- Two 10GBASE-T connectors
- One 1000BASE-T / 2.5GBASE-T connector
- Two SATA connectors, up to 6Gbps
- Four USB 3.2 Gen 1 (5Gbps)
- 2x UART ports
- Connector with 12 GPIO ports
- Connectors for optional BMC module and I/O break-out
- Fan connector
- ATX-style power connector and 12V single supply
- POST code LED display
- Size 305 mm x 244 mm (ATX form factor)
Specifications
| Technology | COM-HPC Server carrier |
| Form Factor | ATX |
| Storage Interfaces | 2x SATA connectors, up to 6Gbps, available on board connector 1x M.2-Slot (Key ID M), type 2242/2280, PCIe x4 Gen 3/4, associated with COM-HPC PCIe[4:7] 1x M.2-Slot (Key ID M), type 2242/2280/22110, PCIe x4 Gen 3/4, associated with COM-HPC PCIe[8:11] Feature availability depending on installed module type. Please consult the product documentation for details. |
| USB | 4x USB 3.2 Gen 1 (5Gbps), on I/O shield, associated with COM-HPC USB[0:3] & USB[0:3]_SSTX/RX 4x USB 2.0 associated with COM-HPC USB[4:7] available on pin-header Feature availability depending on installed module type. Please consult the product documentation for details. |
| Serial Interfaces | 2x serial port on pin header Feature availability depending on installed module type. Please consult the product documentation for details. |
| Bus Interfaces | 1x PCI Express x4 slot, Gen 3/4, associated with COM-HPC PCIe[0:3] 1x PCI Express x4 slot, Gen 3/4, associated with COM-HPC PCIe[12:15] 1x PCI Express x8 on x16 slot, Gen 3/4, associated with COM-HPC PCIe[16:23] 1x PCI Express x8 on x16 slot, Gen 3/4, associated with COM-HPC PCIe[24:31] 1x PCI Express x16 slot, Gen 3/4, associated with COM-HPC PCIe[32:47] Feature availability depending on installed module type. Please consult the product documentation for details. |
| Network Interface | 4x SFP28 cages for up to 25G Ethernet per port, from on-board Intel® Ethernet Connection C827-IM1, associated with COM-HPC ETH[0:3] 2x 10GBASE-T connectors, from on-board Intel® Ethernet Connection X557-AT4, associated with COM-HPC ETH[4:5] 1x 1000BASE-T / 2.5GBASE-T connector, from module, associated with COM-HPC NBASET0 Feature availability depending on installed module type. Please consult the product documentation for details. |
| Miscellaneous | POST code display COM-HPC GPIO_[00:11] on pin header 4-pin fan connector PWM controlled RTC battery, CR2032 |
| Feature Highlights | Versatile COM-HPC Server carrier board for evaluation, prototyping and application development |
| OS Support | BSP ( for onboard devices ) for Windows and Linux Feature availability depending on installed module type. Please consult the product documentation for details. |
| Environment | Ambient Temperature: 0° … +60°C (operating), -25° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing) |
| Dimensions | 305 x 244 |
| Certificates | UL / CE |
