MSC SM2S-EL

The new MSC SM2S-EL module features Intel’s next-generation low-power, multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lake”). Built on 10nm process technology the SoC integrates the next generation Intel Atom processor core architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The module is designed for extended temperature range and 24/7 operation making it an ideal platform for mission critical tasks that require a reliable and performant compute base. It provides significant performance gains over previous Atom generations allowing for technology upgrades within existing power and cooling requirements defined by the system design.
The new MSC SM2S-EL offers triple independent display support with a maximum of 4k resolution, DirectX 12, fast LPDDR4x memory with up to 16GB and optional IBECC capabilities, eMMC 5.1, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient SMARC 2.1.1 Short Size module.
Different SOCs with dual- and quad-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC SM2S-EL offers 2 Gigabit Ethernet with Time-Sensitive Networking (TSN) and 2 CAN-FD interfaces.
For evaluation and design-in of the MSC SM2S-EL module, Avnet Embedded provides a suitable SMARC 2.1.1 development platform. A complete, ready-to-run Starterkit is also available.

Highlights

  • Intel Atom x6xxxRE, Real-time Embedded SKU´s, dual/quad-core (6W-12W)
  • Intel Atom x6xxxE, Embeddded SKU´s, dual/quad-core (6W-12W)
  • Intel Pentium/Celeron J64xx, PC Client SKU´s,quad-core (6W-12W)
  • Intel Pentium/Celeron N6xxx, PC Client SKU´s, dual/quad-core (6W-12W)
  • Integrated Intel UHD Graphics (Gen11)
  • Up to 16GB LPDDR4x SDRAM with IBECC (only Atom SKU´s)
  • Up to 256GB eMMC 5.1, Flash (optional)
  • SATA-III interface (6Gbps)
  • 1x DisplayPort 1.4 / HDMI™ 2.0b
  • 1x DisplayPort 1.4
  • LVDS / Embedded DisplayPort and MIPI-DSI
  • Triple Independent Display support
  • DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan v1.1
  • Up to 4x PCI Express x1/x2/x4 Gen. 3
  • 2x USB 3.1 Host interfaces (1x Host/Device)
  • 6x USB 2.0 Host interfaces (1x Host/Device)
  • 2x Gigabit Ethernet with TSN/TCC
  • 1x SGMII Interface on PCIE-D (optional)
  • UART, SPI, I2C, SMBus
  • 2x CAN-FD
  • HD/I2S Audio, SD Card interface
  • Trusted Platform Module (optional)
  • SMARC 2.1 compliant
  • UEFI Firmware

Specifications

Technologyx86
Form FactorSMARC™ Short Size
CPUIntel Atom x6425RE Processor, quad-core, 1.9GHz, 32EU, TCC, IBECC, 12W, IUC Intel Atom x6416RE Processor, quad-core, 1.7GHz, 16EU, TCC, IBECC, 9W, IUC Intel Atom x6414RE Processor, quad-core, 1.5GHz, 16EU, TCC, IBECC, 9W, IUC Intel Atom x6214RE Processor, dual-core, 1.4GHz, 16EU, TCC, IBECC, 6W, IUC Intel Atom x6212RE Processor, dual-core, 1.2GHz, 16EU, TCC, IBECC, 6W, IUC Intel Atom x6425E Processor, quad-core, 2.0/3.0GHz, 32EU, IBECC, 12W, EUC Intel Atom x6413E Processor, quad-core, 1.5/3.0GHz, 16EU, IBECC, 9W, EUC Intel Atom x6211E Processor, dual-core, 1.3/3.0GHz, 16EU, IBECC, 6W, EUC Intel Pentium J6426 Processor, quad-core,2.0/3.0GHz, 32EU, 10W, PUC Intel Pentium N6415 Processor, quad-core, 1.2/3.0GHz, 16EU, 6W, PUC Intel Celeron J6413 Processor, quad-core, 1.8/3.0GHz, 16EU, 10W, PUC Intel Celeron N6211 Processor, quad-core, 1.2/3.0GHz, 16EU, 6W, PUC Intel® Technologies: Enhanced Intel® SpeedStep® Technology Intel® Virtualization Technology (VTx-2, VT-d) Intel® Trusted Execution Engine (TXE) Intel® Time Coordinated Computing (TCC) Precision Time Measurement (PTM) Precision Time Measurement (PTP) IUC - Intel Industrial Use Conditions EUC - Intel Embedded Use Conditions PUC - Intel PC Client Use Conditions
ChipsetIntegrated in SOC
RAMUp to 16GB LPDDR4x SDRAM, up to 4267MT/s, IBECC (only Atom SKU´s), soldered
FlashUp to 256GB eMMC V5.1 Flash, soldered (optional)
Storage Interfaces1x SATA-III 6Gbps 1x SD 3.01/SDIO 3.0
USB2x USB 3.1 Host interfaces (1x Host/Device)
6x USB 2.0 Host interfaces (1x Host/Device)
Serial Interfaces4x UART (two with handshake)
Bus InterfacesUp to 4x PCI-Express x1 Gen. 3 lanes 1x I2C Bus 1x SPI Bus (Boot) 1x SPI Bus (general purpose)/ eSPI (optional) 1x SMBus 2x CAN-FD (Flexible Data-Rate)
Display ControllerIntegrated Intel UHD Graphics (Gen11) Up to 32 execution units (EU) 3D Acceleration: DirectX, OpenGL 4.5, OpenCL 1.2, Vulkan 1.0 Video Decode: MPEG-2, H.265/HEVC (L5.1), H.264, (L5.2), VC-1, WMV9, VP8, VP9, MVC, JPEG/MJPEG
Display InterfacesThree independent displays supported 2x DP++ Dual-Channel LVDS 24/18 bit up to 1920 x 1200 @ 60Hz or Embedded DisplayPort 1.3 up to 4096 x 2160 @ 60Hz and MIPI-DSI x4 Interface up to 2560 x 1600 @ 60Hz (optional)
Network Interface2x 10/100/1000Base-T 1x SGMII Interface on PCIE-D (optional)
Audio InterfaceHigh Definition Audio and I2S Audio or 2x I2S Audio
Security DeviceInfineon Trusted Platform Module 2.0 (optional)
MiscellaneousWatchdog Timer: Initiates system reset, (programmable, 1s … 255h) Fan Supply: PWM Speed Control for system fan on carrier board RTC battery: external System Monitoring: Voltage, Temperature, CPU Fan, System Fan
Feature HighlightsSMARC™ 2.1 compliant
FirmwareAMI Aptio UEFI
OS SupportWindows 10 IoT Enterprise RS5 (64bit) Windows 10 IoT Core RS5 (64bit) Linux (Yocto Project)
Power Requirement+5V +/-5% +5V Standby
EnvironmentTemperature Range: 0° … 60°C (operating) -25° … 85°C (storage) -40° … 85°C (operating industrial) Humidity: 5 … 95% (operating, non-condensing) 5 … 95% (storage, non-condensing)
Dimensions82 x 50 mm
CertificatesUL / CE
CoolingHeatspreader Heatsink
CarrierMSC SM2-MB-EP1

Order Info

Order No.DescriptionReferenceStatus
 88129SMARC 2.1.1 module with Intel Atom x6425RE, Quad-Core (1.9GHz), 12W,16GB LPDDR4x (3200 MT/s) IBECC, 32EU, TCC, 64GB eMMC, 2x GbELAN, 1x SATA, 2xUSB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0,LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°CMSCSM2S-EL-x6425RE-46N0281IPCBFTX PV
 87436SMARC 2.1.1 module with Intel Atom x6425RE, Quad-Core (1.9GHz), 12W,4GB LPDDR4x (3733 MT/s) IBECC, 32EU, TCC, 4GB eMMC, 2x GbELAN, SGMII on PCIe_D, no SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1xHost/Device), 2x DP++, TPM 2.0, eDP, IUC (Industrial use conditions),extended temperature -25°C...+85°CMSCSM2S-EL-x6425RE-22N0191EPCBFTX OR
 88125 SMARC 2.1.1 module with Intel Atom x6414RE, Quad-Core (1.5GHz), 9W,4GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, 32GB eMMC, 2x GbELAN, SGMII on PCIe_D, no SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1xHost/Device), TPM 2.0, LVDS, IUC (Industrial use conditions), industrialtemperature -40...+85°CMSCSM2S-EL-x6414RE-25N0291IPCBFTX PV
 88121SMARC 2.1.1 module with Intel Atom x6212RE, Dual-Core (1.2GHz), 6W,4GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, 16GB eMMC, 2x GbELAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0,LVDS, IUC (Industrial use conditions), industrial temperature -40...+85°CMSCSM2S-EL-x6212RE-24N0281IPCBFTX PV
88127SMARC 2.1.1 module with Intel Atom x6425E, Quad-Core (2.0GHz/3.0GHz),12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, 64GB eMMC, 2x GbELAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0,LVDS, EUC (Embedded use conditions),extended temperature -25°C...+85°CMSCSM2S-EL-x6425E-46N0281EPCBFTXPV
88123SMARC 2.1.1 module with Intel Atom x6413E, Quad-Core (1.5GHz/3.0GHz),9W, 8GB LPDDR4x (3733 MT/s), IBECC, 16EU, 32GB eMMC, 2x GbELAN, SGMII on PCIe_D, no SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1xHost/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extendedtemperature -25°C...+85°CMSCSM2S-EL-x6413E-35N0291EPCBFTX PV
88119SMARC 2.1.1 module with Intel Atom x6211E, Dual-Core (1.3GHz/3.0GHz),6W, 4GB LPDDR4x (3733 MT/s), IBECC, 16EU, 16GB eMMC, 2x GbELAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0,LVDS, EUC (Embedded use conditions),extended temperature -25°C...+85°CMSCSM2S-EL-x6211E-24N0281EPCBFTXPV
88116SMARC 2.1.1 module with Intel Pentium J6426, Quad-Core (2.0GHz/3.0GHz), 10W, 16GB LPDDR4x (3200 MT/s), 32EU, 64GB eMMC, 2xGbE LAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device),TPM 2.0, LVDS, PUC (PC Client use conditions), standard temperature0...+60°CMSCSM2S-EL-J6426-46N0281CPCBFTXPV
88114SMARC 2.1.1 module with Intel Celeron J6413, Quad-Core (1.8GHz/3.0GHz), 10W, 8GB LPDDR4x (3733 MT/s), 16EU, 16GB eMMC, 2x GbELAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, PUC (PC Client use conditions), standardtemperature 0...+60°CMSCSM2S-EL-J6413-34N0281CPCBFTXPV
96349SMARC 2.1.1 module with Intel Atom x6413E, Quad-Core (1.5GHz/3.0GHz),9W, 4GB LPDDR4x (3733 MT/s), IBECC, 16EU, 128GB eMMC, 2x GbE LAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), industrial temperature -40...+85°C2MSC SM2S-EL-x6413E-27N0281I PCBFTXPV
90305SMARC 2.1.1 module with Intel Atom x6414RE, Quad-Core (1.5GHz), 9W, 4GB LPDDR4x (3733 MT/s) IBECC, 32EU, TCC, 4GB eMMC, 2x GbE LAN, SGMII on PCIe_D, no SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), 2x DP++, TPM 2.0, eDP, IUC (Industrial use conditions), extended temperature -25°C...+85°CMSC SM2S-EL-x6414RE-22N0191E PCBFTX PV
110394SMARC 2.1.1 module with Intel Atom x6413E, Quad-Core (1.5GHz/3.0GHz),9W, 4GB LPDDR4x (3733 MT/s), IBECC, 16EU, 32GB eMMC, 2x GbELAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), industrialtemperature -40...+85°CMSC SM2S-EL-x6413E-25N0180I PCBFTXPV
111756SMARC 2.1.1module with Intel Atom x6425E, Quad-Core (2.0GHz/3.0GHz), 12W, 16GB LPDDR4x (3200 MT/s), IBECC, 32EU, no eMMC, 2x GbE LAN, 1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device), TPM 2.0, LVDS, EUC (Embedded use conditions), extended temperature -25...+85°CMSC SM2S-EL-x6425E-4NN0281E PCBFTX PV
111991SMARC 2.1.1 module with Intel Atom x6414RE, quad-core (1.5GHz), 9W,8GB LPDDR4x (3733 MT/s) IBECC, 16EU, TCC, no eMMC, 2x GbE LAN,1x SATA, 2x USB 3.1 (1x Host/Device), 6x USB 2.0 (1x Host/Device),LVDS, TPM 2.0, IUC (Industrial use conditions), industrial temperature-40...+85°CMSCSM2S-EL-x6414RE-3NN0281IPCBFTX PV

Accessories

Carrier Options

Order No.DescriptionReference
68488SMARC 2.0 Embedded Platform with PCI Express x4 slot, GbE, SATA, USB 3.0, USB 2.0, USB 2.0 OTG, RS232, CAN, SPI, eSPI, SMBus, I2C and GPIO interface, LVDS/eDP, DisplayPort and HDMI display interface, regulated backlight supply, HD/I2S audio interface, MIPI CSI-2 camera interface, mini PCI Express card slot, SD card slot, fan connector, CMOS battery, Mini-ITX form factor (170 x 170 mm), ATX power connector and single 12V/24V power jack, commercial temperature range 0..+70°CMSC SM2-MB-EP1-001 PCBFTX
85087SMARC 2.x compatible embedded platform (146 x 80mm), 10-36V input voltage, 3x RS232, 1x RS485, dual RJ45 LAN with LED (1 x LAN i210), 1x M.2 2280 Key M slot, mPCIe slot, 1x USB 3.0 Type A, 1x USB 3.0/ DisplayPort Type C , 1x USB 2.0 Type A, 1x USB 2.0 internal, 1x μUSB 2.0 Host/Device, 2x SPI, I²C, 12 GPIO on FC, 1x DisplayPort++ , LVDS/ eDP/DSI on JILI30 connector, μSD Card Slot, regulated backlight supply, HD Audio with amplifier, system fan connector, camera connector, RTC battery. Industrial temperature range -40..+85°C, x86 full versionMSC SM2S-MB-EP5-001 PCBFTX
83979SMARC 2.x compatible embedded platform (146 x 80mm), 12V input voltage, 3x RS232, 1x RS485, dual RJ45 LAN with LED, 1x M.2 2280 Key M slot , 1x USB 2.0 Type A, 1x USB3.0 Type A, 1x USB 2.0 internal, 1x μUSB 2.0 Host/Device, 2x SPI, 12 GPIO on FC, 1x DisplayPort++ , LVDS/eDP/DSI on JILI30 connector, regulated backlight supply, RTC battery, Industrial temperature range -40..+85°C, x86 slim versionMSC SM2S-MB-EP5-003 PCBFTX

Cooling Options

Order No.DescriptionReference
82414Passive Heatsink for SM2S-EL variants with Atom processor, consisting of a single-piece aluminium pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffsMSC SM2S-EL-01 HSI-001
85122Heatspreader for SM2S-EL variants with Atom processor, consisting of a single-piece aluminium plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffsMSC SM2S-EL-01 HSP-001
88512Passive Heatsink for SM2S-EL variants with Pentium/Celeron processor, consisting of a single-piece aluminium pin cooler and thermal pad for contact to the processor, with 2.7mm through-hole standoffsMSC SM2S-EL-02 HSI-001
88511Heatspreader for SM2S-EL variants with Pentium/Celeron processor, consisting of a single-piece aluminium plane and thermal pad for contact to the processor, with 2.7mm through-hole standoffsMSC SM2S-EL-02 HSP-001

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