QCS6490 Vision-AI Development Kit
The QCS6490 Vision-AI Development Kit features an energy-efficient, multi-camera, SMARC 2.1.1 compute module, based on the Qualcomm QCS6490 SOC device.
High performance cores on the QCS6490 SOC include an 8-core Kryo™ 670 CPU, Adreno 643 GPU, Hexagon DSP and 6th gen AI Engine (13 TOPS), Spectra 570L ISP (64MP/30fps capability) and Adreno 633 VPU (4K30/4K60 enc/dec rates), ensure that exceptional concurrent video I/O processing performance is delivered.
A useful subset of the SMARC’s interfaces are pinned-out on the carrier board, to support four cameras, two displays, five USB interfaces, CAN-FD, Gigabit Ethernet and optional high-speed Wi-Fi networking. The audio subsystem includes two PDM microphones, stereo audio Codec, digital audio interface and analog audio jack I/O.
Integrated TPM and Wi-Fi/BT modules are offered as a SMARC assembly option.
The carrier board has M.2 slots for NVME storage and advanced wireless options. Compact 100 mm x 79 mm carrier board dimensions and mounting hole alignment with similar AI developer boards, enable a drop-in capability with many enclosures.
The development kit ships with a Yocto-based Linux BSP, plus example AI and multi-camera open-source applications. Additional OS options are available, with Windows 11 IoT Enterprise due in 2H24. (Qualcomm also supports Android and Ubuntu Linux on the QCS6490, but for this platform it will depend on demand).
Highlights
Target Applications:
- Ruggedized Handheld Scanners & Tablets
- Mobile Vision-AI Edge Compute Applications
- Info kiosks, Vending Machines, Interactive HMI
- Multi-camera Security Systems with Recognition
- Service & Industrial Robots
Key Features:
- 8-core (4x A78, 4x A55) QCS6490 SMARC module
- 6th gen NPU (12 TOPS) and 3D GPU (Adreno 643)
- VPU (4k30 enc/4K60 dec) and triple ISP (Spectra 570L)
- LPDDR5(3200) x32 w/ ECC and UFS 3.1 Flash memory
- 4x MIPI-CSI camera interfaces (concurrent)
- 1x MIPI-DSI and MiniDP display outputs (concurrent)
- 2x PDM mics, audio codec, SAI audio, stereo jack
- 2x USB3.1, 3x USB2.0 and 2x CAN-FD interfaces
- 1 Gbps Ethernet and optional Wi-Fi 6E networking
- 2x M.2 slots, 40-pin and 12-pin expansion headers
Kit Includes:
- Vision AI Carrier Board fitted with SMARC compute module
- 1x MIPI CSI IMX577 12MP camera
- USB-C PD power supply (9V)
- Extruded aluminum heatsink
Specifications
| Technology | 6 nm |
| Dimensions | 100mm x 79mm |
| CPU | 4x A78 4x A55 |
| Chipset | QCS6490 |
| Chipset Brand | Qualcomm |
| RAM | 8 GB |
| Flash | 64 GB |
| Storage Interfaces | PCI Express gen3 x2 interface (M.2 Key-M slot) |
| USB | 2x USB 3.1 3x USB 2.0 |
| Serial Interfaces | 3 in total: 2 @3.3V levels 1 @1.8V levels |
| Bus Interfaces | PCIe gen3 x2 interface (M.2 Key-M slot) PCIe gen3 x1 interface (M.2 Key-E slot) SDIO x4 (M.2 Key-E slot) |
| PCI Express | 1x PCI Express gen3 x2 |
| Display Controller | Adreno 643 GPU |
| Display Interfaces | 1x MIPI-DSI (4-lane) 1x MiniDisplayPort |
| Network Interface | 1x 1Gb/s, RJ45 connector with two status LEDs |
| Audio Interface | 2x PDM Microphones DA7212 Codec stereo analog audio jack SAI digital audio header+AS3 |
| Security Device | Assembly option |
| Camera Interface | 4x MIPI CSI |
| OS Support | Yocto Linux Win 11 IoT Enterprise (Ubuntu Linux and Android options not currently supported) |
| Power Requirement | 9V @3A USB-C PD power supply included |
| Min Temperature (°C) | -20C |
| Max Temperature (°C) | +85C |
| Cooling | Passive heat-spreader |
| Wireless Module | Wi-Fi 6E BT5.4 options * SMARC module assembly option * M.2 Key-E slot |
Order Info
Download Product Brief
Click the link below to download QCS6490 Vision-AI Development Kit product brief.
