TRIA C6C-RYZ8

The COM Express Type 6 module TRIA C6C-RYZ8 is ideal for applications like medical imaging, gaming platforms, AI enhanced solutions in the edge and security appliances. With the on-chip XDNA Neural Processing Unit, it is the right fit for enabling AI applications, that run on the local system independently from a cloud-based approach. Applications also gain outstanding compute performance from up to eight CPU cores and six RDNA3 work group processors integrated into the AMD RyzenTM Embedded 8000 Series Processor.

The module provides up to four independent display pipes with high-resolution, highest-level graphics and video en-/ decoding acceleration. The Type 6 pin-out allows direct access to high bandwidth display output from interfaces like eDP, LVDS, DisplayPort, and HDMI. Further high-bandwidth interfaces include USB 3.2/2.0, PCIe Gen 3/4, and 1/2.5Gb Ethernet.

The module with space-saving COM Express Compact formfactor can be equipped with up to 128GB of fast DDR5 SO-DIMM memory. The TRIA C6C-RYZ8 offers hardware based security compliant to the requirements of TCG (Trusted Computing Group) and features TPM 2.0 capability.

Highlights

  • COM Express Type 6, Compact module
  • AMD Ryzenâ„¢ Embedded 8000 Series Processor
  • Up to eight cores/sixteen threads
  • Integrated AI accelerator (XDNA Neural Processing Unit)
  • Up to 128GB DDR5-5600 SDRAM, dual channel, ECC
  • Up to six RDNA3 work group processors (WGP)
  • Four independent display streams
  • Selectable display outputs from up to three DisplayPort/HDMI, LVDS, eDP
  • Up to twenty PCI Express® Gen 4/3 lanes
  • Two USB 3.2 Gen1/2 and eight USB 2.0 ports
  • Two UARTs
  • Optional on-board NVMe SSD, up to 1TB
  • Up to two SATA 6Gb/s mass storage interfaces
  • 1 / 2.5 Gb Ethernet port (Intel® i226)
  • Trusted Platform Module TPM 2.0
  • Long-term product availability

Specifications

Technologyx86
Form FactorCOM Express Compact Type 6
CPUAMD RyzenTM 7 Pro 8845HS, eight core, 3.8/5.1GHz, 8MB L2 / 16MB L3, 6 WGP, 45W (35-54W) TDP,
DDR5-5600
AMD RyzenTM 5 Pro 8645HS, six core, 4.3/5.0GHz, 6MB L2 / 16MB L3, 4 WGP, 45W (35-54W) TDP,
DDR5-5600
AMD RyzenTM 7 Pro 8840U, eight core, 3.3/5.1GHz, 8MB L2 / 16MB L3, 6 WGP, 28W (15-30W) TDP,
DDR5-5600
AMD RyzenTM 5 Pro 8640U, six core, 3.5/4.9GHz, 6MB L2 / 16MB L3, 4 WGP, 28W (15-30W) TDP,
DDR5-5600
ChipsetIntegrated into System-on-Chip
RAM2x 262-pin SO-DIMM socket for up to 2x 64 GB DDR5 SDRAM (DDR5-5600) ECC option dual channel
operation
Note: maximum DDR5 bandwidth depending on assembled memory module type
Storage InterfacesUp to 2x SATA 6Gb/s
optional on-board NVMe, 64GB to 1TB
USB2x USB 3.2 Gen 2 / USB 2.0
6x USB 2.0
Serial Interfaces2x serial ports
Bus InterfacesPCIe Gen 4 1x8 or 2x4 on COME PEG[0:7]
PCIe Gen 4 1x4 on COME PEG[8:11], optional, mutually exclusive with on-board NVMe
PCIe Gen 4 1x4 on COME PCIE[0:3], flexible bifurcation options
PCIe Gen 3 4x1 on COME PCIE[4:7], depending on assembly variant
LPC bus (Low Pin Count bus)
Display ControllerRDNA3, up to six work group processors
Four independent displays supported
Display InterfacesDisplay Port and HDMI/DVI:
Up to 3x Digital Display Interface, usable as DisplayPort 2.1 (up to 10Gbps)¹, also usable as HDMI 2.1
(up to 10Gbps)¹ or DVI (up to 1920 x 1200 @ 60Hz)
¹ Re-timer required for operation above 3Gb/s
1x Embedded DisplayPort 1.5 (on variants without LVDS only)
LCD:
LVDS 24bit, dual-channel (not on all variants) 1920 x 1200 @ 60Hz
Network Interface10/100/1000Base-TX, 2.5G² based on Intel i226-LM
² Available bandwidths depending on carrier design
Audio InterfaceHigh Definition Audio
Security DeviceTPM 2.0
MiscellaneousWatchdog Timer:
Initiates system reset, programmable
Fan Supply:
4-pin header for CPU fan, PWM speed controlled
and PWM speed control for system fan supported
RTC battery:
external
System Monitoring:
voltage, temperature, CPU fan, system fan
FirmwareUEFI Firmware:
AMI Aptio® V
Security:
TPM 2.0 support, TCG compliant
Power Management:
ACPI
Active fan control
USB:
USB legacy support (keyboard, mouse, storage)
Monitoring:
System Monitoring
Health Monitoring
MSC Adv. Boot Device Selection:
Boot device priority setting based on physical interfaces
OS SupportWindows 11
BSP for Linux (Yocto)
Power RequirementVoltage:
+8.5V to +20V, +5V Stby optional, +3V RTC voltage
Power Consumption:
tbd W to tbd W (typ.)
EnvironmentAmbient Temperature:
0° … 60°C (operating)
-25° … 85°C (storage)
Humidity:
5 … 95% (operating, non-condensing),
5 … 95% (storage, non-condensing)
Dimensions95mm x 95mm
CertificatesUL / CE

Order Info

Order No.DescriptionReferenceStatus
tbdCOM Express Type 6 Compact module (95mm x 95mm) CPU: AMD Ryzen 7 Pro 8845HS, eight-core, 3.8/5.1GHz, 35-54W TDP, 6 WGP 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel) 1x 1GbE 2x SATA 2x USB3, 8x USB2 4x PCIe Gen 4, 4x PCIe Gen 3, PEG 3x4 Gen 4 TPM 2.0 2x socket for DDR5 or DDR5ECC SO-DIMM DDR5-5600 0° … 60°CMSC C6C-RYZ8-8845HS- NN221C PCBFTXPV
tbdCOM Express Type 6 Compact module (95mm x 95mm) CPU: AMD Ryzen 7 Pro 8840U, eight-core, 3.3/5.1GHz, 15-30W TDP, 6 WGP 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel) 1x 1GbE 2x SATA 2x USB3, 8x USB2 4x PCIe Gen 4, 4x PCIe Gen 3, PEG 3x4 Gen 4 TPM 2.0 2x socket for DDR5 or DDR5ECC SO-DIMM DDR5-5600 0° … 60°CMSC C6C-RYZ8-8840U- NN221C PCBFTXPV
tbdCOM Express Type 6 Compact module (95mm x 95mm) CPU: AMD Ryzen 5 Pro 8645HS, six-core, 4.3/5.0GHz, 35-54W TDP, 4 WGP 3x DP/HDMI/DVI, LVDS (24 Bit, dual channel) 1x 1GbE 2x SATA 2x USB3, 8x USB2 4x PCIe Gen 4, 4x PCIe Gen 3, PEG 3x4 Gen 4 TPM 2.0 2x socket for DDR5 or DDR5ECC SO-DIMM DDR5-5600 0° … 60°CMSC C6C-RYZ8-8645HS- NN221C PCBFTXPV
tbdCOM Express Type 6 Compact module (95mm x 95mm) CPU: AMD Ryzen 5 Pro 8640U, six-core, 3.5/4.9GHz, 15-30W TDP, 4 WGP 3x DP/HDMI/DVI, eDP 1x 1GbE 2x SATA 2x USB3, 8x USB2 4x PCIe Gen 4, PEG 3x4 Gen 4 TPM 2.0 2x socket for DDR5 or DDR5ECC SO-DIMM DDR5-5600 0° … 60°CMSC C6C-RYZ8-8640U- NN101C PCBFTXPV

Accessories

Carrier Options

Order No.DescriptionReference
111650COM Express Type 6 Evaluation Carrier Board with various PCI Express x1, x4 and x16 slots, USB 3.0/2.0, GbE, M.2, SD card socket, SATA, DisplayPort, LVDS, eDP, VGA, HD audio interfaces; ATX power connector. Dimensions 305 x 244 mm (ATX form factor)MSC C6-MB-EV4 PCBFTX

Cooling Options

Order No.DescriptionReference
tbdPassive Heatsink for C6C-RYZ8 consisting of a single-piece aluminum profile with fins, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe.MSC C6C-RYZ8-01 HSI-001
tbdPassive Heatsink / heat pipe for C6C-RYZ8 consisting of a single-piece aluminum profile with fins and embedded heatpipe, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe.MSC C6C-RYZ8-01 HSI- HP-001
tbdHeatspreader for C6C-RYZ8. Single-piece aluminum profile, standoffs without thread (2.7mm inner diameter), screws and thermopads for the thermal contact to CPU, chipset, NVMe.MSC C6C-RYZ8-01 HSP-001
tbdHeatspreader / heat pipe for C6C-RYZ8. Single-piece aluminum profile with embedded heat pipe, standoffs without thread (2.7mm inner diameter), screws and thermopad for the thermal contact to CPU, chipset, NVMe.MSC C6C-RYZ8-01 HSP- HP-001
tbdHeatspreader for C6C-RYZ8. Single-piece aluminum profile, standoffs with M2.5 thread, screws and thermopads for the thermal contact to CPU, chipset, NVMe.MSC C6C-RYZ8-02 HSP-001

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Download Datasheet

Click the link below to download TRIA C6C-RYZ8 datasheet.