TRIA HMM-RLP
The TRIA HMM-RLP module featuring the COM-HPC Mini formfactor is ideal for system designs that require outstanding performance and flexible IO connectivity in smallest possible space. The module is perfect for applications such as automation solutions, drone and robot controllers, rugged HMI platforms, compact medical units, measurement equipment, and in transportation.
Based on the 13th Gen Intel® Core™ processor, system designers can pick from a variety of choices of power efficient and performant module options. The architecture scales up to fourteen cores and twenty threads at 35W thermal design power (TDP). For applications with need for lower power dissipation, selected processor variants can be operated down to 12W TDP. The board is ideal for mission critical applications supporting extended temperature range, 24/7 continuous operation, memory down with in-band ECC protection and optional conformal coating.
System investments are well protected through long-term availability of the module, designed, and manufactured by Tria Technologies. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Highlights
- COM-HPC Mini module
- 13th Gen Intel® Core™ processors
- Scalable CPU performance, up to fourteen cores, twenty threads
- Industrial grading options (Intel® TCC, TSN, IBECC, ext Temp., 24/7)
- LPDDR5-6000 main memory, memory-down, up to 64GB, In-band ECC option
- Intel® Iris® Xe architecture Graphics, up to 96 EUs
- Up to four independent displays
- Embedded DisplayPort interface
- Supports COM-HPC Mini Config 1, 2
- Up to two DisplayPort/HDMI interface (DDI)
- Up to two USB4 port, up to four USB 3.2 Gen2x1, eight USB 2.0 ports
- PCI Express® Gen 3, up to 8 lanes with flexible bifurcation options, PCI Express® Gen 4, up to 2x4
- Dual MIPI-CSI
- Optional on-board NVMe SSD, up to 1TB
- Two 1 / 2.5 Gb Ethernet ports (Intel® i226)
- Optional two SATA 6Gb/s mass storage interfaces
- Two UARTs
- Trusted Platform Module TPM 2.0
- Long-term product availability
Specifications
| Technology | x86 |
| Form Factor | COM-HPC Mini |
| CPU | 13th Gen Intel® Core™ processors H-series Intel® Core™ i7-13800HE 6P+8E/20T, 2.5GHz, 96 EUs, 24MB L3, 45/35W cTDP Intel® Core™ i7-13800HRE 6P+8E/20T, 2.5GHz, 96 EUs, 24MB L3, 45/35W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-13600HE 4P+8E/16T, 2.7GHz, 80 EUs, 18MB L3, 45/35W cTDP Intel® Core™ i5-13600HRE 4P+8E/16T, 2.7GHz, 80 EUs, 18MB L3, 45/35W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i3-13300HE 4P+4E/12T, 2.1GHz, 48 EUs, 12MB L3, 45/35W cTDP Intel® Core™ i3-13300HRE 4P+4E/12T, 2.1GHz, 48 EUs, 12MB L3, 45/35W cTDP, TCC/TSN, IBECC, ET P-series Intel® Core™ i7-1370PE 6P+8E/20T, 1.9GHz, 96 EUs, 24MB L3, 28/20W cTDP Intel® Core™ i7-1370PRE 6P+8E/20T, 1.9GHz, 96 EUs, 24MB L3, 28/20W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-1350PE 4P+8E/16T, 1.8GHz, 80 EUs, 12MB L3, 28/20W cTDP Intel® Core™ i5-1350PRE 4P+8E/16T, 1.8GHz, 80 EUs, 12MB L3, 28/20W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-1340PE 4P+8E/16T, 1.8GHz, 80 EUs, 12MB L3, 28/20W cTDP Intel® Core™ i3-1320PE 4P+4E/12T, 1.7GHz, 48 EUs, 12MB L3, 28/20W cTDP Intel® Core™ i3-1320PRE 4P+4E/12T, 1.7GHz, 48 EUs, 12MB L3, 28/20W cTDP, TCC/TSN, IBECC, ET, TCC/ TSN, IBECC, ET U-series Intel® Core™ i7-1365UE 2P+8E/12T, 1.7GHz, 96 EUs, 12MB L3, 15/12W cTDP Intel® Core™ i7-1365URE 2P+8E/12T, 1.7GHz, 96 EUs, 12MB L3, 15/12W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-1345UE 2P+8E/12T, 1.4GHz, 80 EUs, 12MB L3, 15/12W cTDP Intel® Core™ i5-1345URE 2P+8E/12T, 1.4GHz, 80 EUs, 12MB L3, 15/12W cTDP, TCC/TSN, IBECC, ET Intel® Core™ i5-1335UE 2P+8E/12T, 1.3GHz, 80 EUs, 12MB L3, 15/12W cTDP Intel® Core™ i3-1315UE 2P+4E/8T, 1.2GHz, 64 EUs, 10MB L3, 15/12W cTDP Intel® Core™ i3-1315URE 2P+4E/8T, 1.2GHz, 64 EUs, 10MB L3, 15/12W cTDP, TCC/TSN, IBECC, ET Intel® Processor U300E 1P+4E/6T, 1.1GHz, 48 EUs, 8MB L3, 15/12W cTDP Note: P core base frequency at nominal TDP shown, other clock frequencies supported |
| Chipset | Integrated into SoC |
| RAM | LPDDR5 memory, up to 6000 MT/s memory-down Capacity options: 4GB, 8GB, 16GB, 32GB, 64GB |
| Storage Interfaces | 2x SATA channels (up to 6Gb/s), optional, mutually exclusive with COM-HPC PCIe[6,7] Note: dedicated BIOS image required Optional on-board NVMe, 64GB to 1TB, mutually exclusive with COM-HPC PCIe[12:15] |
| USB | Up to two USB4 on COM-HPC SS Lane 2, 3 (mutually exclusive with DD1) and Lane 4, 5 (mutually exclusive with USB3 #2, #3) Two USB 3.2 Gen 2x1 on COM-HPC SS Lane 6, 7 (USB3 #0, #1) Up to two USB 3.2 Gen 2x1 on COM-HPC SS Lane 4, 5 (mutually exclusive with USB4 #1 8x USB 2.0 on COM-HPC USB[0:7] Note: supported interfaces depending on COM-HPC carrier design. Config 3 on request |
| Serial Interfaces | 2x high-speed serial ports |
| Bus Interfaces | PCI Express® Gen 4, up to 2x4 on COM-HPC PCIe[8:15], PCIe[12:15] mutually exclusive with on-board NVMe PCI Express® Gen 3, up to 8 lanes, flexible bifurcation options on COM-HPC PCIe[0:7], PCIe[6,7] mutually exclusive with COM-HPC SATA[0,1] Note: dedicated BIOS image required |
| Display Controller | Intel® Iris® Xe architecture Graphics, up to 96 execution units (EU) H.264/AVC, H.265/HEVC, AV1, MJPEG encode/decode/transcode |
| Display Interfaces | Up to four independent display streams Supports COM-HPC Mini Config 1, 2 Up to two DisplayPort/HDMI interface (DDI), DP 1.4a, HDMI 2.1, Config 1 Up to two USB4/USB-C ports (DP tunneling), 1x USB4 with Config 2 1x Embedded DisplayPort 1.4b Note: supported interfaces depending on COM-HPC carrier design. Config 3 on request |
| Network Interface | Two 10/100/1000Base-TX, 2.5G¹ based on Intel i226, TSN support ¹ Available bandwidths depending on carrier design I-Temp variants: Intel® i226-IT C-Temp variants: Intel® i226-LM |
| Audio Interface | High Definition Audio (HDA) Optional SoundWire (COM-HPC SNDW[2:3] mutually exclusive with HDA) |
| Security Device | TPM 2.0 |
| Miscellaneous | 2x MIPI CSI camera interface on FFC connectors Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan User space in EEPROM |
| Firmware | UEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management: ACPI Active fan control USB: USB legacy support (keyboard, mouse, storage) Monitoring: System Monitoring Health Monitoring MSC Adv. Boot Device Selection: Boot device priority setting based on physical interfaces |
| OS Support | Windows 11 IoT Enterprise LTSC BSP for Linux (Yocto) |
| Power Requirement | Voltage: +8V to +20V, +3V RTC voltage Power Consumption: tbd W to tbd W (typ.) |
| Environment | Ambient Temperature: 0° … 60°C (operating) -25° … 85°C (storage) Extended temp. variants: -40 ... +85°C (operating) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing) |
| Dimensions | 95mm x 70mm |
| Certificates | UL / CE |
