XRF Heatsink V2

Passive/Active Cooling Solution for XRF AMD RFSoC System-on-Modules

The XRF Heatsink V2 (AES-XRF-HEATSINK-V2) is designed to meet the thermal relief demands of XRF modules operating in a laboratory environment at 25⁰C with external convection. Airflow through the aluminum fins must be provided externally or by attaching the optional fan assembly (AES-XRF-HEATSINK-V2-FAN). This heatsink assembly can be ordered at avnet.me/xrf-passive-cooling.

Quick-start instructions for assembling XRF heatsinks to the XRF module are included in the XRF Getting Started Guide and further explained in detail in XRF Thermal Considerations – both documents are available by request at RFINFO@avnet.com.

Important Considerations
Careful thermal analysis must be performed before using AES-XRF-HEATSINK-V2 in a deployed product as it was designed strictly to meet the needs of software developers operating the module in a controlled laboratory environment.
XRF products are intended to operate in condensation-free environments only. If subjected to cycling within a thermal chamber, Dry Air Purge or Gaseous Nitrogen (GN2) should be used to minimize condensation. If subjected to cycling outside of a controlled chamber, conformal coating or other measures may be required to avoid damage due to condensation.

Custom XRF Thermal Solutions:
Tria also offers customized cooling solution development for your system. Please contact your Tria sales representative or RFINFO@avnet.com