MSC C6C-RYZ2

The MSC C6C-RYZ2 module is the embedded platform for the AMD RyzenTM Embedded R2000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained real-estate, power and cooling. Customers can choose from a variety of quad and dual-core processors to scale performance and capabilities according to application requirements.

The board provides up to four independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory and multiple USB 3.2/2.0 interfaces complete the compact and power saving module.

The MSC C6C-RYZ2 offers hardware based security compliant to the requirements of TCG (Trusted Computing Group) and features TPM 2.0 capability.

The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 2.0b and DVI as well as up to four USB 3.2 interfaces.

Highlights

  • AMD RyzenTM Embedded R2544, quad-core Processor (3.35/3.7GHz, 8 GPU CU, 35-54W TDP)
  • AMD RyzenTM Embedded R2514, quad-core Processor (2.1/3.7GHz, 8 GPU CU, 12-35W TDP)
  • AMD RyzenTM Embedded R2314, quad-core Processor (2.1/3.5GHz, 6 GPU CU, 12-35W TDP)
  • AMD RyzenTM Embedded R2312, dual-core Processor (2.7/3.5GHz, 3 GPU CU, 12-25W TDP)
  • Up to 32 GB DDR4-3200 SDRAM, dual-channel, optional ECC
  • Two SATA 6Gb/s mass storage interfaces
  • Three DisplayPort/HDMI/DVI interfaces
  • Embedded DisplayPort / LVDS (24 Bit, dual channel) interface
  • Up to four independent displays supported
  • OpenGL 4.6, OpenCL
  • Resolution up to 4096 x 2160
  • Up to four USB 3.2/2.0 and four USB 2.0 interfaces
  • Up to eight PCI Expressâ„¢ x1 lanes
  • PEG configurable up to 1×8 or 2×4
  • Trusted Platform Module TPM 2.0
  • UEFI Firmware

Specifications

Technology:x86
Form Factor:COM Express Compact
CPU:AMD RyzenTM Embedded R2544, quad-core Processor, 3.35/3.7GHz, 2MB L2 / 4MB L3, 8 GPU CU, 45W (35-54W) TDP, max. DDR4-3200; AMD RyzenTM Embedded R2514, quad-core Processor, 2.1/3.7GHz, 2MB L2 / 4MB L3, 8 GPU CU, 15W (35-12W) TDP, max. DDR4-2667; AMD R
Chipset:Integrated in System-on-Chip
RAM:2x 260-pin SO-DIMM socket for up to 2x 16 GB DDR4 SDRAM (DDR4-3200 max); ECC option; dual channel operation Note: maximum DDR4 bandwidth depending on processor variant and assembled memory module type
Storage Interfaces:2x SATA 6Gb/s
USB:Up to 4x USB 3.2 Gen 1 / USB 2.0rn4x USB 2.0rnNote: Supported number of ports depending on board assembly
Serial Interfaces:2x serial ports
Bus Interfaces:PEG port max x8 (depending on processor variant) Up to four PCI Express x1 Gen3, up to four x1 Gen 2 (depending on processor and assembly variant) LPC bus (Low Pin Count bus)
Display Controller:GPU Vega core, up to 8 CUs Up to four independent displays supported (depending on processor variant)
Display Interfaces:Display Port and HDMI/DVI: Up to 3x Digital Display Interface, usable as DisplayPort 1.4 (up to 3840 x 2160 @ 60Hz)¹, also usable as HDMI 2.0b (4096 x 2160 @ 60Hz)¹ or DVI (up to 1920 x 1200 @ 60Hz) ¹ Re-timer required for operation above 3Gb/s 1x
Network Interface:10/100/1000Base-TX (Intel i210)
Audio Interface:High Definition Audio
Security Device:TPM 2.0 (optional)
Miscellaneous:Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: external System Monitoring: voltage, temperature, CPU fan, system fan
Feature Highlights:Type 6 pin-out
Firmware:UEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management: ACPI Active fan control USB: USB legacy support (keyboard, mouse, storage) Monitoring: System Monitoring Health Monitoring MSC Adv. Boot Device Selection: Boot de
OS Support:Windows 10 21H2 LTSC Windows 11 21H2 GAC Linux, Yocto
Power Requirement:Voltage: +12V primary power supply input, +5V Stby optional Power Consumption: 28 W to 64 W (typ., variant dependent)
Environment:Ambient Temperature; 0° … 60°C (operating), -25° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing)
Dimensions:95mm x 95mm
Certificates:UL / CE
Cooling:Passive heat sink Active heat sink with fan Heat spreader with threaded or non-threaded standoffs
Carrier:Small carrier board (Mini-ITX) as part of a starter kit Evaluation board in ATX form factor

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