MSC HCA-MLH
The MSC HCA-MLH COM-HPC Client module features the Intel® Core™ Ultra processor, providing developers with a powerful workhorse to boost their target applications. The module is ideal for challenging tasks in robotics, medical, public safety, and gaming that require uncompromising performance. The architecture scales up to sixteen cores and twenty-two threads at 28/15W thermal design power (TDP). Together with the integrated AI accelerator (NPU) and up to 128 GPUs, the processor greatly supports AI projects and compute intense duties.
For highest data throughput the module enables fast DDR5 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to ninety-six GB. Up to sixteen PCIe Gen 4 lanes and an eight lane PEG port (PCIe Gen 5) allow for accessing external accelerators, storage, and I/O at high throughput. Two Ethernet interfaces provide up to 2.5GbE bandwidth each based on the Intel i226 network controller.
System investments are well protected through long-term availability of the module, designed, and manufactured by Tria Technologies. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.
Highlights
- COM-HPC Client, Size A module
- Intel® Core™ Ultra Processors Series 1 and 2
- Up to sixteen cores, twenty-two threads
- Integrated AI accelarator (NPU) Intel® AI Boost
- Up to 96GB DDR5-6400 SDRAM, dual channel, IB-ECC
- Intel® Arc™ Graphics, up to 8 Xe cores (128 EUs)
- Three DisplayPort/HDMI interfaces
- Embedded DisplayPort interface
- Four independent display streams
- Up to sixteen PCI Express® Gen 4 lanes
- PEG 1×8, PCIe Gen 4 (optional)
- Two USB4, two USB 3.2 Gen1/2 and eight USB 2.0 ports
- Two UARTs
- Optional on-board NVMe SSD, up to 1TB
- Up to two SATA 6Gb/s mass storage interfaces
- Two 1 / 2.5 Gb Ethernet ports (Intel® i226)
- Trusted Platform Module TPM 2.0
- Long-term product availability for selected variants
Specifications
| Technology | x86 |
| Form Factor | COM-HPC Size A |
| CPU | Intel® Core™ Ultra Processors Series 2: Intel® Core™ Ultra 9 processor 285H 6P+8E+2LPE/22T, 2.9GHZ, 8Xe/128EUs, 24MB L3, vPRO®, 45W BP Intel® Core™ Ultra 7 processor 265H 6P+8E+2LPE/22T, 2.2GHZ, 8Xe/128EUs, 24MB L3, vPRO®, 28W BP Intel® Core™ Ultra 7 processor 255H 6P+8E+2LPE/22T, 2.0GHZ, 8Xe/128EUs, 24MB L3, 28W BP Intel® Core™ Ultra 5 processor 235H 4P+8E+2LPE/18T, 2.4GHZ, 8Xe/128EUs, 18MB L3, vPRO®, 28W BP Intel® Core™ Ultra 5 processor 225H 4P+8E+2LPE/18T, 1.7GHZ, 7Xe/112EUs, 18MB L3, 28W BP Intel® Core™ Ultra 7 processor 265U 2P+8E+2LPE/14T, 2.1GHZ, 4Xe/64EUs, 12MB L3, vPRO®, 15W BP Intel® Core™ Ultra 7 processor 255U 2P+8E+2LPE/14T, 2.0GHZ, 4Xe/64EUs, 12MB L3, 15W BP Intel® Core™ Ultra 5 processor 235U 2P+8E+2LPE/14T, 2.0GHZ, 4Xe/64EUs, 12MB L3, vPRO®, 15W BP Intel® Core™ Ultra 5 processor 225U 2P+8E+2LPE/14T, 1.5GHZ, 4Xe/64EUs, 12MB L3, 15W BP Intel® Core™ Ultra Processors Series 1: Intel® Core™ Ultra 7 processor 165H 6P+8E+2LPE/22T, 1.4GHZ, 8Xe/128EUs, 24MB L3, vPRO®, 28W BP Intel® Core™ Ultra 7 processor 155H 6P+8E+2LPE/22T, 1.4GHZ, 8Xe/128EUs, 24MB L3, 28W BP Intel® Core™ Ultra 5 processor 135H 4P+8E+2LPE/18T, 1.7GHZ, 8Xe/128EUs, 18MB L3, vPRO®, 28W BP Intel® Core™ Ultra 5 processor 125H 4P+8E+2LPE/18T, 1.2GHZ, 7Xe/112EUs, 18MB L3, 28W BP Intel® Core™ Ultra 7 processor 165U 2P+8E+2LPE/14T, 1.7GHZ, 4Xe/64EUs, 12MB L3, vPRO®, 15W BP Intel® Core™ Ultra 7 processor 155U 2P+8E+2LPE/14T, 1.7GHZ, 4Xe/64EUs, 12MB L3, 15W BP Intel® Core™ Ultra 5 processor 135U 2P+8E+2LPE/14T, 1.6GHZ, 4Xe/64EUs, 12MB L3, vPRO®, 15W BP Intel® Core™ Ultra 5 processor 125U 2P+8E+2LPE/14T, 1.3GHZ, 4Xe/64EUs, 12MB L3, 15W BP Note: P core base frequency at processor base power (BP) shown, other clock frequencies at different power levels supported |
| Chipset | Integrated into SoC |
| RAM | 2x 262-pin SO-DIMM socket for up to 2x 48GB DDR5 SDRAM DDR5-6400 Series 2 processors DDR5-5600 Series 1 processors dual channel operation minimum capacity 1x 8GB single channel operation inband ECC (IB-ECC) option (OS dependent) |
| Storage Interfaces | 2x SATA channels (up to 6Gb/s), optionaloptional on-board NVMe, 64GB to 1TB |
| Bus Interfaces | PCI Express® Graphics (PEG) 1x8, PCIe Gen 4/5 on COM-HPC PCIe[16:23]¹PCI Express® Gen 4, up to 2x4 on COM-HPC PCIe[8:15]PCI Express® Gen 4, up to 8 lanes, flexible bifurcation options on COM-HPC PCIe[0:7]¹ Available on H-series processors |
| Display Controller | Intel® Arc™ Graphics, up to 8 Xe cores / 128 execution units (EU) H.264/AVC, H.265/HEVC, AV1, MJPEG encode/decode/transcode |
| Display Interfaces | Four independent display streams 2x USB4/USB-C ports (DP tunneling) 3x Digital Display Interface (DP 2.1, HDMI 2.1) 1x Embedded DisplayPort 1.4b |
| Network Interface | Two 10/100/1000Base-TX, 2.5G² based on Intel i226-LM² Available bandwidths depending on carrier design |
| Audio Interface | High Definition Audio |
| Security Device | TPM 2.0 |
| Miscellaneous | Watchdog Timer:Initiates system reset, programmableFan Supply:4-pin header for CPU fan, PWM speed controlledand PWM speed control for system fan supportedRTC battery:externalSystem Monitoring:voltage, temperature, CPU fan, system fan |
| Feature Highlights | COM-HPC Client |
| Firmware | UEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management:ACPIActive fan controlUSB:USB legacy support (keyboard, mouse, storage)Monitoring:System MonitoringHealth MonitoringMSC Adv. Boot Device Selection:Boot device priority setting based on physical interfaces |
| OS Support | Windows 10 IoT Enterprise 2021 LTSCWindows 11 IoT Enterprise LTSC (future availability)BSP for Linux (Yocto) |
| Power Requirement | Voltage:+8V to +20V, +5V Stby optional, +3V RTC voltagePower Consumption:tbd W to tbd W (typ.) |
| Environment | Ambient Temperature:0° … 60°C (operating)-25° … 85°C (storage)Humidity:5 … 95% (operating, non-condensing),5 … 95% (storage, non-condensing) |
| Dimensions | 120 x 95 |
| Certificates | UL / CE |
