MSC HCC-CFLS

The MSC HCC-CFLS module is the first member of the new COM-HPC product family. It enables a PICMG COM-HPC Client interface and features size C module format. The Client interface offers a wide range of I/O, including multiple graphics interfaces, 1G and BASE-T Ethernet as well as PCIe and USB data paths. Designed for the 9th Generation Intel® Core™ S-Series Processor family, the module comes with the greatest scalability, from cost efficient Pentium up to most performant Core i7 processor. Depending on selected processor variant up to eight cores can be utilized by most demanding applications. A total of 64GB of main memory provides extended and reliable space for data intensive tasks. The graphics units on the MSC HCC-CFLS provide highest level graphics acceleration and hardware based video en-/decoding. They connect to three DDI interfaces and one eDP display port allowing for a maximum of three independent displays at up to 4k x 2k resolution. The 16 lane width PEG port based on PCIe Gen 3 gives system designers the possibility to integrate external graphics and AI accelerators into their application. Further I/O include additional PCIe lanes, USB 3 Gen1 and 2, SATA, 1G and 10GBASE-T Ethernet and GPIOs. For lab evaluation, rapid prototyping and application development Avnet Embedded offers the MSC HC-MB-EV, a COM-HPC Client carrier.

Highlights

  • Intel® Coreâ„¢
  • i7-9700E (8C/8T, 2.6/4.4GHz, 65W TDP)
  • i7-9700TE (8C/8T, 1.8/3.8GHz, 35W TDP)
  • i5-9500E (6C/6T, 3.0/4.2GHz, 65W TDP)
  • i5-9500TE (6C/6T, 2.2/3.6GHz, 35W TDP)
  • i3-9100E (4C/4T, 3.1/3.7GHz, 65W TDP)
  • i3-9100TE (4C/4T, 2.2/3.2GHz, 35W TDP)
  • Intel® Pentium®
  • G5400T (2C/4T, 3.1GHz, 35/25W TDP/cTDP)
  • Intel® UHD Graphics
  • Intel® chipsets Q370 or H310
  • Up to 64GB DDR4-2666 SDRAM
  • Two SATA 6Gb/s mass storage interfaces
  • Up to three DisplayPort/HDMI/DVI interfaces
  • One Embedded DisplayPort interface
  • Up to triple independent display support
  • DirectX 12, OpenGL 4.5, OpenCL 2.x
  • Resolution up to 4096 x 2304
  • 1x 1G and 1x 10GBASE-T Ethernet
  • Up to sixteen PCI Expressâ„¢ x1 lanes, configurable up to x4, Intel® Rapid Storage Technology support
  • PEG configurable as 1×16 or 2×8 or 1×8 + 2×4
  • Four USB 3.1/2.0 and four USB 2.0 interfaces
  • Trusted Platform Module
  • UEFI Firmware

Specifications

Technology:x86
Form Factor:COM-HPC Client Size C
CPU:Intel® Core™ i7-9700E (eight-core/eight threads, 2.6/4.4GHz, 12MB cache, 65W TDP) i7-9700TE (eight-core/eight threads, 1.8/3.8GHz, 12MB cache, 35W TDP) i5-9500E (six-core/six threads, 3.0/4.2GHz, 9MB cache, 65W TDP) i5-9500TE (six-core/six threads
Chipset:Intel® Platform Controller Hubs (PCH) Q370 or H310 (reduced feature set) Q370: 3x DisplayPort, 3 independent displays, PEG port bifurcation, 16x PCIe Gen 3 x1 lanes (configurable up to x4) H310: 2x DisplayPort, 2 independent displays, 6x PCIe Gen 2
RAM:2x 260-pin SO-DIMM socket for up to 2x 32GB DDR4 SDRAM (DDR4-2666); dual channel operation
Storage Interfaces:2x SATA channels (up to 6Gb/s)
USB:4x USB 3.1 (Gen 1 & 2), paired with USB 2.0 on USB[0:3]+/- 8x USB 2.0 on USB[0..7]+/-
Serial Interfaces:2x high-speed serial ports from PCH
Bus Interfaces:16x PCI Express x1 Gen 3, configurable up to x4 (Q370 only) 6x PCIe Gen 2 x1 lanes (H310 only) 1x PCI Express Graphics (PEG) x 16 Gen 3
Display Controller:Integrated Intel ®UHD graphics Gen 9 3D Acceleration: DirectX® 11/12, OpenGL 4.3/4.4, OpenGL ES 2.0, OpenCL 2.x; HW accelerated Video Decode: H.264/AVC, VP8, VP9, VP9 10 Bit, H.265/HEVC 8 bit, H.265/HEVC 10 Bit, MPEG2, MJPEG, VC-1 HW accelerated Vi
Display Interfaces:Display Port and HDMI/DVI: Up to 3x Digital Display Interface, usable as DisplayPort 1.2 (up to 4096 x 2304 @ 60Hz), also usable as HDMI 1.4b or DVI (up to 4096 x 2160 @ 30Hz) 1x Embedded DisplayPort 1.4; 4096 x 2304 @ 60Hz Note: three out of for dis
Network Interface:1x 10/100/1000BASE-TX (integrated in PCH, Intel® i219LM PHY) 1x 10GBASE-T (optional)
Audio Interface:Total of up to 4x MIPI SoundWire audio interface: Up to 2x DMIC (multiplexed with COM-HPC SNDW0/1) Note: COM-HPC SNDW2/3 are multiplexed with I2S
Security Device:TPM 2.0
Miscellaneous:Watchdog Timer: Initiates system reset, programmable Fan Supply: 4-pin header for 12V CPU fan, PWM speed controlled and PWM speed control for system fan supported RTC battery: External System Monitoring: Voltage, temperature, CPU fan, system fan
Firmware:UEFI Firmware: AMI Aptio® V Security: TPM 2.0 support, TCG compliant Power Management: ACPI Active fan control USB: USB legacy support (keyboard, mouse, storage) Monitoring: System Monitoring Health Monitoring MSC Adv. Boot Device Selection: Boot de
OS Support:Windows 10 IOT Enterprise BSP for Linux (Yocto) EAPI (HW Programming Interface)
Power Requirement:Voltage: +8.0V to +16V, Stby optional Power Consumption: tbd
Environment:Ambient Temperature; 0° … 60°C (operating), -25° … 85°C (storage) Humidity: 5 … 95% (operating, non-condensing), 5 … 95% (storage, non-condensing)
Dimensions:160mm x 120mm (Height depending on cooling solution)
Certificates:UL / CE
Cooling:Certificates

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