MSC SM2S-ASL
The new MSC SM2S-ASL module features the Intel Atom® processors x7000RE/C Series (codenamed “Amston Lake”). The CPU architecture is based on the same Efficient-cores and Intel® UHD graphics driven by Xe architecture as the 12th Gen Intel® Core™ processors, thus easing up application migration across Intel® CPU performance and power ranges. With support for up to eight processor cores, the module fits to a wide range of applications including point-of-sales terminals, digital signage controllers, HMI solutions and medical equipment. The board is ideal for system products that are exposed to harsh ambient conditions. It is designed for extended temperature range and 24/7 continuous operation.
The new MSC SM2S-ASL offers triple independent display support with a maximum of 4k resolution, fast LPDDR5 memory with up to 16GB and optional IBECC capabilities, eMMC 5.1, USB 3.1 and PCIe Gen3 on a power saving and cost-efficient SMARC 2.1.1 module.
Different SOCs with dual-, quad- and eight-core processors are supported by this design. In addition to an extensive set of interfaces and features, the MSC SM2S-ASL offers 2 Gigabit Ethernet based on Intel® i226 and supports up to 2.5GbE bandwidth.
For evaluation and design-in of the MSC SM2S-ASL module, Avnet Embedded provides a suitable SMARC 2.1.1 development platform. A complete, ready-to-run Starterkit is also available.
Highlights
- Up to eight processing cores
- Power efficient processors, TDP 6 to 12W
- Integrated Intel UHD Gen.12 graphics, max. 32 executing units
- Up to 16GB LPDDR5 SDRAM, In-band ECC
- Up to 256GB eMMC 5.1 Flash (optional)
- SATA-III interface (6Gbps)
- 2x DP++
- LVDS / Embedded DisplayPort and MIPI-DSI
- Triple Independent Display support
- 2x MIPI-CSI Camera Interface
- Up to 4x PCI Express x1/x2/x4 Gen. 3
- 2x USB 3.1 Host interfaces
- 6x USB 2.0 Host interfaces
- 2x 1/2,5 Gigabit Ethernet (Intel® i226)
- 1x SGMII Interface on PCIE-D
- UART, SPI, I2C, SMBus .
- HD/I2S Audio
- Trusted Platform Module TPM 2.0
- SMARC 2.1.1 compliant
- UEFI Firmware
Specifications
| Technology: | x86 |
| Form Factor: | SMARC® 2.1.1 Short Size |
| CPU: | Intel Atom® x7835RE, octa-core, 1.3GHz, 32EU, TCC, 12W, IUC, ETIntel Atom® x7433RE, quad-core, 1.5GHz, 32EU, TCC, 9W, IUC, ETIntel Atom® x7213RE, dual-core, 2.0GHz, 16EU, TCC, 9W, IUC, ETIntel Atom® x7211RE, dual-core, 1.0GHz, 16EU, TCC, 6W, IUC, |
| Chipset: | Integrated in SOC |
| RAM: | Up to 16GB LPDDR5 SDRAM, up to 4800MT/s, IBECC, soldered |
| Flash: | Up to 256GB eMMC V5.1 Flash, soldered (optional) |
| Storage Interfaces: | 1x SATA-III 6Gbps |
| Bus Interfaces: | Up to 4x PCI-Express x1 Gen. 3 lanes1x I2C Bus1x SPI Bus (Boot)1x SPI Bus (general purpose)/ eSPI (optional)1x SMBus |
| Display Controller: | Integrated Intel UHD Graphics (Gen12)Up to 32 execution units (EU)Note: only available with the Intel Atom Processor x7000RE Series |
| Display Interfaces: | Three independent displays supported2x DP++Dual-Channel LVDS 24/18 bit up to 1920 x 1200 @ 60Hz orEmbedded DisplayPort 1.4b up to 4096 x 2304 @ 60Hz andMIPI-DSI x4 Interface up to 4096 x 2160 @ 60Hz (optional)Note: display interfaces are only availab |
| Network Interface: | 2x 10/100/1000Base-T, up to 2.5Gbps based on Intel i226 with TSN support1x SGMII (up to 2.5Gbps) Interface on PCIE-D |
| Audio Interface: | High Definition Audio and I2S Audioor 2x I2S Audio |
| Security Device: | Infineon Trusted Platform Module 2.0 |
| Miscellaneous: | MIPI CSI-2 camera interface (CSI0, 2 lane)MIPI CSI-2 camera interface (CSI1, 4 lane)Watchdog Timer:Initiates system reset, (programmable, 1s … 255h)Fan Supply:PWM Speed Control for system fan on carrier boardRTC battery:externalSystem Monitoring:Vo |
| Feature Highlights: | SMARC™ 2.1.1 compliant |
| Firmware: | AMI Aptio UEFI |
| OS Support: | Windows 10 IoT Enterprise 2021 LTSCYocto Project (LTS kernel 2021) |
| Power Requirement: | +5V +/-5%+5V Standby |
| Environment: | Temperature Range:Commercial: 0° … 60°C (operating)Industrial: -40° … 85°C (operating)-25° … 85°C (storage)Humidity:5 … 95% (operating, non-condensing)5 … 95% (storage, non-condensing) |
| Dimensions: | 82 x 50 mm |
| Certificates: | UL / CE |
| Cooling: | Heatspreader Heatsink |
| Carrier: | MSC SM2-MB-EP1 |