MSC SM2S-IMX8PLUS

The MSC SM2S-IMX8Plus module features NXP’s i.MX 8M Plus processors that are based on latest 14nm FinFET technology to allow high computing and graphics performance at very low power consumption combined with a high degree of functional integration

MSC SM2S-IMX8PLUS offers dual- or quad-core ARM Cortex-A53 processors in combination with the ARM Cortex-M7 real-time processor, GC 7000UL multimedia 2D/ 3D GPU and a Machine Learning Accelerator (2.3 TOPS). It provides fast LPDDR4 memory, up to 256GB eMMC Flash memory, 2x Gigabit Ethernet with IEEE 1588 support and one of them with TSN support, PCI Express Gen. 3, USB3.0, USB 2.0, an on-board Wireless Module (WLAN/BT), the Image Signal Processor supports 2x MIPI-CSI (4-lane), as well as an extensive set of interfaces for embedded applications.

The module is compliant with the new SMARC™ 2.1 standard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the SM2S-IMX8PLUS module, Avnet Embedded /MSC provides a development platform and a starter kit. Multiple Operating Systems like Linux, Android 12 and Windows 10 IoT Enterprise are supported.

Highlights

  • Dual or Quad core ARM Cortex-A53 Applications Processor up to 1.8GHz
  • ARM Cortex-M7 Real Time Processor at 800MHz
  • GC7000UL 2D/3D Graphics Processor with OpenCL and Vulkan support
  • 1080p60 H.265 decode, 1080p60 H.264 encode (VPU not available on ”Plus Quad Lite“)
  • Machine Learning Accelerator (2.3 TOPS) (NPU not available on ”Plus Quad Lite“)
  • Hifi4 Audio DSP, operating up to 800MHz
  • Image Sensor Processor (ISP) supports 12MP@30fps, 4kp45, or 2x 1080p80
  • Up to 8GB LPDDR4 SDRAM with inline ECC support
  • Up to 256GB eMMC 5.1 Flash
  • HDMI 2.0a with up to 4k resolution
  • LVDS (dual channel)/ 2x LVDS (single channel)/ MIPI-DSI x4 (optional)
  • MIPI CSI-2 Camera Interface
  • PCI Express x1 Gen. 3
  • up to 2x USB 3.0 Host interface
  • up to 3x USB 2.0 Host interface
  • 1x USB 2.0/3.0 Host/Device interface
  • 2x Gigabit Ethernet (IEEE 1588, 1x with TSN)
  • Wireless Module (optional)
  • MMC/SD/SDIO interface
  • 2x CAN-FD interface
  • 2x I2S Audio Interface
  • UART, SPI, I2C
  • SMARC 2.1 compliant
  • Linux BSP
  • Android 12 BSP
  • Windows 10 IoT Enterprise BSP

Specifications

Technology:ARM
Form Factor:SMARC Short Size
CPU:NXP i.MX 8M Plus ARM Cortex-A53 Applications Processor - i.MX 8M Plus Quad with NPU, ISP, VPU, HIFI4, CAN, 1.8GHz, Consumer - i.MX 8M Plus Quad with ISP, VPU, CAN, 1.8GHz, Consumer - i.MX 8M Plus QuadLite with CAN, 1.8GHz, Consumer - i.MX 8M Plus Dua
Chipset:SOC
RAM:Up to 8GB 4000MT/s LPDDR4 SDRAM, inline ECC support, soldered
Flash:Up to 256GB eMMC Flash QSPI NOR Flash 64MB (optional)
Storage Interfaces:1x MMC (up to v 5.1)/ SD/SDIO (up to v 3.0)
USB:1x USB 2.0 Host/Client, 2x USB 2.0 Host, 2x USB3.0 Host or 1x USB 3.0 Host/Client, 3x USB 2.0 Host, 1x USB3.0 Host (optional) or 1x USB 2.0 Host/Client, 1x USB 2.0 Host (optional)
Serial Interfaces:2x UART with 2-wire hand shake 2x UART w/o hand shake
Bus Interfaces:1x PCI Express x1 Gen.3 lane 5x I2C up to 320 Kbit/s 2x CAN-FD / 2.0B 2x SPI (with two chip selects)
Display Controller:Vivante GC7000UL 2D/3D Graphics Processing Unit (GPU) 3D Graphics Acceleration, 2 shader, 16 GFLOPs OpenGL ES 1.1, 2.0, 3.0, OpenCL 1.2, Vulkan Video Processing Unit (not available on ”Plus Quad Lite“) with hardware support for 1080p60 HEVC H.265
Display Interfaces:dual-channel LVDS interface, 18 or 24 bit (up to 1920x1080) or 2 x single-channel LVDS interface (up to 1366x768) (optional) or MIPI-DSI Display Interface, 4 lanes, up to 1920x1200 @ 60fps (optional) or 1 x MIPI-DSI and 1 x single channel LVDS (optio
Network Interface:2x 10/100/1000BASE-T Ethernet IEEE 1588 support, one with TSN support HD Wireless Module SPB209A with 802.11ac / Bluetooth 5.0 with PCM interface, soldered (optional)
Audio Interface:2x I2S Audio
Security Device:Advanced Security, Safety, and Reliability integrated in the SOC (CSU) Trusted Platform Module (TPM) 2.0 (optional)
Miscellaneous:Watchdog Timer for system reset (programmable, 1s … 600s) RTC (optional: temperature compensated) 14x GPIO, configurable as input or output 64kbit ID EEPROM on I2C bus MIPI CSI-2 camera interface (CSI0, 2 lane) or MIPI CSI-2 camera interface (CSI2,
Feature Highlights:Neural Processing Unit (NPU) with 2.3 TOP/s Speech recognition, Image recognition
OS Support:Linux Board Support Package Android 12 Board Support Package Windows 10 IoT Enterprise LTSC 2021 BSP
Power Requirement:Power Supply +5V +/-5%, 5V Standby Power Consumption 2-7 W typ. (depending on CPU and optional features)
Environment:Temperature Range: Commercial: 0° … 70°C (operating) -20° … 85°C (storage) Extended: -25° … 85°C (operating) -40° … 85°C (storage) Industrial: -40° … 85°C (operating) -40° … 85°C (storage) Humidity: 5 … 95% (operating, non-c
Dimensions:82 x 50 mm
Certificates:UL / CE
Cooling:Heatspreader
Carrier:MSC SM2-MB-EP1, MSC SM2-MB-EP5

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