Vision AI-KIT 6490

Qualcomm Dragonwing™ QCS6490 Development Kit

The Vision AI-KIT 6490 features an energy-efficient, multi-camera, SMARC 2.1.1 compute module, based on the Qualcomm QCS6490 SOC device.

High performance cores on the Vision AI-KIT 6490 (Qualcomm Dragonwing™ QCS6490 Development Kit) include an 8-core Kryo™ 670 CPU, Adreno 643 GPU, Hexagon DSP and 6th gen AI Engine (12 TOPS), Spectra 570L ISP (64MP/30fps capability) and Adreno 633 VPU (4K30/4K60 enc/dec rates), ensure that exceptional concurrent video I/O processing performance is delivered.

A useful subset of the SMARC interfaces are pinned-out on the carrier board, to support four cameras, two displays, five USB interfaces, CAN-FD, Gigabit Ethernet and optional high-speed Wi-Fi networking. The audio subsystem includes two PDM microphones, stereo audio Codec, digital audio interface and analog audio jack I/O.

Integrated TPM and Wi-Fi/BT modules are offered as assembly options of the QCS6490 SMARC compute module. The carrier board has M.2 slots for NVME storage and advanced wireless options. Compact 100 mm x 79 mm carrier board dimensions and mounting hole alignment with similar AI developer boards, enable a drop-in capability with many enclosures.

Qualcomm Linux BSP (Yocto, 6.6 kernel), plus a range of AI/ML and multimedia open-source example applications are provided. Windows 11 IoT Enterprise and Android support will release in 1H25. (Ubuntu Linux for QCS6490 may at later date be supported.)

Highlights

Target Applications:

Ruggedized Handheld Scanners & Tablets
Mobile Vision-AI Edge Compute Applications
Info kiosks, Vending Machines, Interactive HMI
Multi-camera Security Systems with Recognition
Service & Industrial Robots

Key Features:

8-core (4x A78, 4x A55) QCS6490 SMARC module
6th gen NPU (12 TOPS) and 3D GPU (Adreno 643)
VPU (4k30 enc/4K60 dec) and triple ISP (Spectra 570L)
LPDDR5(3200) x32 w/ ECC and UFS 3.1 Flash memory
4x MIPI-CSI camera interfaces (concurrent)
1x MIPI-DSI and MiniDP display outputs (concurrent)
2x PDM mics, audio codec, SAI audio, stereo jack
2x USB3.1, 3x USB2.0 and 2x CAN-FD interfaces
1 Gbps Ethernet and optional Wi-Fi 6E networking
2x M.2 slots, 40-pin and 12-pin expansion headers

Kit Includes:

Vision AI Carrier Board fitted with SMARC compute module
1x MIPI CSI IMX577 12MP camera
USB-C PD power supply (9V)
Extruded aluminum heatsink

Specifications

Technology	6 nm
Dimensions	100mm x 79mm
CPU	4x A78 4x A55
Chipset	QCS6490
Chipset Brand	Qualcomm
Chipset Sub-brand	Dragonwing Q Series
RAM	8 GB
Flash	64 GB
Storage Interfaces	PCI Express gen3 x2 interface (M.2 Key-M slot)
USB	2x USB 3.1 3x USB 2.0
Serial Interfaces	3 in total: 2 @3.3V levels 1 @1.8V levels
Bus Interfaces	PCIe gen3 x2 interface (M.2 Key-M slot) PCIe gen3 x1 interface (M.2 Key-E slot) SDIO x4 (M.2 Key-E slot)
PCI Express	1x PCI Express gen3 x2
Display Controller	Adreno 643 GPU
Display Interfaces	1x MIPI-DSI (4-lane) 1x MiniDisplayPort
Network Interface	1x 1Gb/s, RJ45 connector with two status LEDs
Audio Interface	2x PDM Microphones DA7212 Codec stereo analog audio jack SAI digital audio header+AS3
Security Device	Assembly option
Camera Interface	4x MIPI CSI
OS Support	Yocto Linux Win 11 IoT Enterprise (Ubuntu Linux and Android options not currently supported)
Power Requirement	9V @3A USB-C PD power supply included
Min Temperature (°C)	-20C
Max Temperature (°C)	+85C
Cooling	Passive heat-spreader
Wireless Module	Wi-Fi 6E BT5.4 options * SMARC module assembly option * M.2 Key-E slot